Glass-Substrate Via Assembly for TGV Quality Control
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Solution Overview
Problem
Current semiconductor substrates face defects in Through Glass Vias (TGVs) that adversely affect reliability and yield due to uncontrolled quality in the manufacturing process.
Innovation Solution
The semiconductor substrate is manufactured by separately inspecting and forming a first structure with vertical conductive connectors and a second structure with a glass layer, allowing for improved quality control of both components before assembly, enhancing reliability and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If TGVs are produced by forming seed layers and performing plating in through holes of glass layer, then the through glass vias can be created, but defects occur in the TGVs that adversely affect reliability and yield
Solution Approach 1:
The manufacturing process is divided into separate stages: first forming the vertical conductive connectors on a carrier, then forming the glass layer with through holes separately, and finally assembling them together. This segmentation allows independent inspection and quality control of each component, reducing defects in the final TGV structure.
Solution Approach 2:
The vertical conductive connectors are formed and inspected on the carrier before the glass layer is formed. This preliminary action allows for early detection and removal of defective connectors, preventing them from being assembled into the final product and thus improving overall reliability.
2Manufacturing precision
If TGVs are produced by forming seed layers and performing plating in through holes of glass layer, then the through glass vias can be created, but defects occur in the TGVs that adversely affect yield
Solution Approach 1:
The glass layer formation is separated from the connector formation process. The glass layer is formed as a distinct structure with through holes, allowing independent quality inspection. This segmentation enables identification and removal of defective glass layers before assembly, protecting the overall yield.
Solution Approach 2:
The glass layer is formed and inspected before assembly with the vertical conductive connectors. This preliminary inspection allows defective glass layers to be identified and discarded before they compromise the final product, thereby maintaining high yield.
3Manufacturing precision
If separate inspection and formation of first structure and second structure is implemented, then quality control of vertical conductive connectors and glass layer is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The manufacturing process is segmented into distinct modules: forming the first structure (vertical conductive connectors on carrier), forming the second structure (glass layer with through holes), and assembling them. While this increases process steps, each module can be optimized independently and inspected separately, improving quality control despite increased complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures better reliability and yield by allowing for the inspection and selection of high-quality vertical conductive connectors and glass layers, reducing defects and improving electrical performance.
Implementation Method 1
The adhesive layer is bonded between the glass layer and the circuit layer
Data Source
AI summary
A semiconductor substrate includes a first structure and a second structure. The first structure includes a circuit layer and a vertical conductive connector. The second structure includes a glass layer and an adhesive layer. The vertical conductive connector is landing on the circuit layer. The glass layer includes a through hole bigger than the vertical conductive connector. The vertical conductive connector of the first structure is assembled in the through hole of the second structure and electrically connected to the circuit layer. The adhesive layer is bonded between the glass layer and the circuit layer.