High Density Vias in Glass Substrates via Selective Etching
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Solution Overview
Problem
Conventional methods for forming metallic vias in glass substrates are inefficient, leading to variations in via depth and increased manufacturing costs due to the need for extensive polishing to ensure vias extend through the substrate thickness.
Innovation Solution
A method involving a glass substrate with distinct layers, where the etch rates or photosensitivities of the cladding and core layers allow for selective cavity formation and removal, ensuring consistent via depth without extensive polishing, by using etchants or electromagnetic radiation to create cavities that extend through the core layer and are filled with metallic material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to form metallic vias in glass substrates, then vias can be formed, but extensive polishing is required to ensure consistent via depth, increasing manufacturing costs and time
Solution Approach 1:
The glass substrate is divided into multiple layers with different etch rates (first glass layer with higher etch rate, second glass layer with lower etch rate). This segmentation allows selective etching to form cavities that extend through the first layer but terminate in the second layer, eliminating the need for extensive polishing to achieve consistent via depth.
Solution Approach 2:
Different regions of the glass substrate are given different etching properties through layering. The first glass layer has higher photosensitivity and etch rate, while the second glass layer has lower photosensitivity and etch rate. This local quality differentiation enables precise control over cavity depth and positioning, ensuring consistent via formation without extensive polishing.
2Manufacturing precision
If extensive polishing is performed to ensure vias extend through the substrate, then via depth consistency is improved, but manufacturing costs increase
Solution Approach 1:
The glass substrate is divided into multiple layers with different etch rates (first glass layer with higher etch rate, second glass layer with lower etch rate). This segmentation allows selective etching to form cavities that extend through the first layer but terminate in the second layer, eliminating the need for extensive polishing to achieve consistent via depth.
Solution Approach 2:
The etch rate parameter is varied across different glass layers through compositional differences. The first glass layer has higher photosensitivity and etch rate, while the second glass layer has lower photosensitivity and etch rate. This parameter change enables precise control over cavity depth, reducing the need for costly polishing operations.
3Productivity
If cavities are formed to extend partially through the glass substrate, then via formation is possible, but variations in cavity depth occur, requiring extensive polishing
Solution Approach 1:
The glass substrate is divided into multiple layers with different etch rates (first glass layer with higher etch rate, second glass layer with lower etch rate). This segmentation allows selective etching to form cavities that extend through the first layer but terminate in the second layer, eliminating the need for extensive polishing to achieve consistent via depth.
Solution Approach 2:
Different regions of the glass substrate are given different etching properties through layering. The first glass layer has higher photosensitivity and etch rate, while the second glass layer has lower photosensitivity and etch rate. This local quality differentiation enables precise control over cavity depth, ensuring uniformity without requiring extensive polishing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the need for extensive polishing, thereby decreasing manufacturing costs and time, while ensuring high-density metallic vias with consistent depth through the glass substrate.
Implementation Method 1
the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer
Implementation Method 2
the glass cladding layer has a photosensitivity in response to application of the electromagnetic radiation that is different than a photosensitivity than the glass central core layer
Data Source
AI summary
A method for forming a via in a glass article includes forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate including a glass cladding layer and a glass central core layer, where the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and where the one or more cavities extend through the glass central core layer terminating at the glass cladding layer, depositing a metallic material within the one or more cavities, and removing the glass cladding layer.