Glass Via Etching Shape Control for Higher Via Density
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Solution Overview
Problem
Conventional single-sided wet etching processes for forming vias in glass substrates result in large via openings on the exposed surface, limited via density, and significant undercutting or lateral etching, leading to poor control over via diameter and density.
Innovation Solution
A double-sided opening process is applied to both surfaces of the glass substrate, followed by a single-sided opening process, to create a via with controlled dimensions and reduced undercutting, using specific etching conditions to shape the via.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single-sided wet etching process is used to form vias in glass substrate, then the etching process is simple and fast, but the via opening becomes large and via density is limited
Solution Approach 1:
The etching process is divided into two independent stages: first etching from the front surface to create initial via openings, then etching from the back surface to complete the via formation. This segmentation allows each etching step to be optimized independently, preventing excessive lateral etching and enabling precise control of final via dimensions while maintaining high via density.
Solution Approach 2:
The via formation process transitions from single-sided (one-dimensional approach) to double-sided etching (two-dimensional approach). By accessing both front and back surfaces of the substrate, the process gains an additional dimension of control, allowing precise via opening size control and high via density without the limitations of single-sided etching.
2Manufacturing precision
If a single-sided wet etching process is used, then the process duration is short, but significant undercutting or lateral etching occurs
Solution Approach 1:
The etching process is divided into two independent stages: first etching from the front surface to create initial via openings, then etching from the back surface to complete the via formation. This segmentation allows each etching step to be optimized independently, preventing excessive lateral etching and enabling precise control of final via dimensions while maintaining high via density.
Solution Approach 2:
The front surface etching creates preliminary via openings that serve as guides for the subsequent back surface etching. This preliminary action establishes the via positions and initial dimensions, allowing the second etching step to complete the via formation with precise dimensional control and minimal undercutting.
3Productivity
If the via opening size is reduced to increase via density, then via density increases, but the etching time increases significantly
Solution Approach 1:
The etching process is divided into two independent stages: first etching from the front surface to create initial via openings, then etching from the back surface to complete the via formation. This segmentation allows each etching step to be optimized independently, preventing excessive lateral etching and enabling precise control of final via dimensions while maintaining high via density.
Solution Approach 2:
The via formation process transitions from single-sided (one-dimensional approach) to double-sided etching (two-dimensional approach). By accessing both front and back surfaces of the substrate, the process gains an additional dimension of control, allowing precise via opening size control and high via density without the limitations of single-sided etching.
4Manufacturing precision
If conventional single-sided etching is used, then the process is simple, but control over via diameter is poor
Solution Approach 1:
The etching process is divided into two independent stages: first etching from the front surface to create initial via openings, then etching from the back surface to complete the via formation. This segmentation allows each etching step to be optimized independently, preventing excessive lateral etching and enabling precise control of final via dimensions while maintaining high via density.
Solution Approach 2:
The via formation process transitions from single-sided (one-dimensional approach) to double-sided etching (two-dimensional approach). By accessing both front and back surfaces of the substrate, the process gains an additional dimension of control, allowing precise via opening size control and high via density without the limitations of single-sided etching.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides precise control over via dimensions, reduces undercutting, and increases via density by minimizing the dependence on substrate thickness, allowing for faster etching and easier metallization without air pockets.
Implementation Method 1
A double-sided opening process is applied to both surfaces of the glass substrate, followed by a single-sided opening process, to create a via with controlled dimensions and reduced undercutting
Implementation Method 2
conventional single-sided wet etching processes for forming vias in glass substrates
Data Source
AI summary
An inorganic substrate with an improved via shape and methods for facilitating formation of such improved via shape are disclosed. A double-sided opening process may be applied to an inorganic substrate to form openings at the ends of a damage track previously formed in the inorganic substrate. One side of the inorganic substrate may then be sealed, such as by being temporarily bonded to a carrier or blocking substrate, so that a single-sided opening process may be applied to the other unsealed or unblocked surface of the inorganic substrate. The single-sided opening process may enlarge at least one of the openings formed by the double-sided opening process and may enlarge a channel between the openings to form a via having an advantageous shape.