Chemically Hardened Glass Wafer Sensor for RF-Safe Precision Handling
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Solution Overview
Problem
Existing semiconductor processing systems face challenges in finding a material for wafer-like sensors that is flat, smooth, dimensionally stable, non-contaminating, and does not interfere with radio frequency communications, as silicon fractures easily and carbon fiber composites are not smooth or flat enough and can interfere with RF communications.
Innovation Solution
The use of chemically-hardened glass (CHG) in a sandwich structure with an annular top piece and a bottom disk, including an anti-shatter film and painted surfaces to prevent contamination and ensure reliable vacuum chucking, along with a recessed pocket for an electronics module, addresses these challenges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If silicon is used as the wafer-like sensor material, then the material provides good flatness and smoothness, but it fractures easily and lacks dimensional stability
Solution Approach 1:
The patent uses a composite structure consisting of a silicon core layer bonded to a glass substrate. The silicon layer provides the required flatness and smoothness for sensor fabrication, while the glass substrate provides dimensional stability and fracture resistance. This composite approach allows the sensor to maintain both manufacturing precision and reliability during processing and operation.
2Reliability
If carbon fiber composite is used as the wafer-like sensor material, then the material provides good strength and dimensional stability, but it is not smooth or flat enough and interferes with RF communications
Solution Approach 1:
The patent combines glass substrate with silicon layer to achieve both dimensional stability and surface quality. The glass provides the stable base while the silicon layer creates the required smooth surface for sensor fabrication, eliminating the need for carbon fiber composites that interfere with RF communications.
3Ease of manufacture
If a single-layer wafer structure is used, then the manufacturing process is simpler, but the sensor cannot provide both structural integrity and sensor functionality
Solution Approach 1:
The wafer-like sensor is divided into distinct functional layers: a glass substrate layer providing structural integrity and a silicon layer providing sensor functionality. This segmentation allows each layer to be optimized for its specific purpose while maintaining overall structural soundness during manufacturing and operation.
4Device complexity
If the wafer-like sensor design does not include a recessed pocket, then the structure is simpler, but the electronics module cannot be properly mounted and protected
Solution Approach 1:
The electronics module is nested within a recessed pocket formed in the glass substrate. This nesting approach protects the sensitive electronics while maintaining a compact, integrated structure. The recessed pocket allows the electronics to be mounted securely without adding significant external complexity to the overall sensor design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The CHG wafer-like sensor provides a stable, non-contaminating, and RF-compatible solution that prevents shard dislodgement and allows for a thinner design, reducing material costs and ensuring precise alignment during manufacturing.
Implementation Method 1
an annular layer formed of chemically-hardened glass and a lower layer formed of chemically-hardened glass, wherein the annular layer is chemically bonded to the lower layer
Data Source
AI summary
A wafer-like semiconductor sensor includes a wafer-like base formed of a plurality of layers of chemically-hardened glass and an electronics module mounted to a recessed pocket in the base and containing a sensor.