Electronic Subassembly Glass Waveguide for Chip-Level Current Sensing
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Solution Overview
Problem
Conventional methods for measuring currents in electronic subassemblies, particularly in power electronics, are limited to external measurements using shunt resistors or Hall converters, lacking the capability to measure currents at individual components within the module or subassembly.
Innovation Solution
Incorporation of a glass sheet with an optical waveguide into the subassembly, allowing for chip-oriented current measurement by routing contacting means through a horizontal opening in the glass sheet, utilizing the optical Faraday effect to deflect polarized laser light and measure current intensity using a photodiode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external shunt resistors or Hall converters are used for current measurement, then measurement capability is provided, but measurement precision at individual components is insufficient
Solution Approach 1:
The optical waveguide is embedded within the glass sheet that is already integrated into the subassembly structure. The glass sheet itself is nested between the mounting plate and component, creating a nested configuration where the waveguide measurement system is housed within the existing structural components, enabling precise component-level measurement without adding external measurement devices
Solution Approach 2:
The glass sheet serves as an intermediary element that performs dual functions: it provides structural support within the subassembly while simultaneously housing the optical waveguide for current measurement. This intermediary structure enables the integration of measurement capability into the existing assembly without requiring separate external measurement systems
2Measurement precision
If glass sheet with waveguide is integrated into subassembly, then chip-oriented current measurement is enabled, but structural complexity increases
Solution Approach 1:
The glass sheet is designed to serve multiple functions simultaneously: it provides mechanical support within the subassembly structure, acts as a mounting substrate for the optical waveguide, and enables current measurement through the waveguide's interaction with the magnetic field. This multi-functionality reduces the need for separate components and minimizes overall structural complexity
Solution Approach 2:
The optical waveguide is merged with the glass sheet structure, and the glass sheet is combined with the existing subassembly components (mounting plate and component). This merging approach integrates the measurement function into the structural components rather than adding separate measurement devices, thereby reducing overall device complexity
3Measurement precision
If contacting means are routed through glass sheet opening, then current measurement is enabled, but manufacturing difficulty increases
Solution Approach 1:
The glass sheet is designed with a segmented structure that includes a specific opening or aperture. This segmentation allows the contacting means (such as wire bonds or leads) to pass through the glass sheet while the surrounding glass material houses the optical waveguide. The segmentation enables both electrical connection and optical measurement functions to coexist within the same component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise, chip-oriented current measurement within the subassembly, increasing measurement accuracy and reducing structural impact, while maintaining structural integrity and allowing for conventional manufacturing processes.
Implementation Method 1
utilizing the optical Faraday effect to deflect polarized laser light and measure current intensity
Data Source
AI summary
Various embodiments of the teachings herein include an electronic subassembly. An example includes: an electronic component; a board; wherein the component and the board extend horizontally relative to each other in various layers within the subassembly; contacting means of the electronic component extending vertically in the subassembly; a glass sheet incorporated into the subassembly in a horizontal installation position; a horizontal opening in the glass sheet through which is routed at least part of the contacting means; an optical waveguide structured in the glass sheet; and two optical connection points for the waveguide by which polarized laser light can be coupled into and out of the waveguide. The glass sheet is arranged between a mounting plate and the component.