Air-Filled Glass Waveguide Package for Low-Loss mmWave Integration
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Solution Overview
Problem
Conventional waveguides for high-frequency signals in the millimeter-wave band suffer from high loss characteristics and require complex, time-consuming processing, and existing solutions like surface integrated waveguides using vias are not optimal for integrating semiconductor chips and waveguides efficiently.
Innovation Solution
A waveguide package using a photosensitive glass substrate with air-filled cavities and metal layers, integrated with semiconductor chips and electronic circuits, allowing for precise manufacturing and minimal signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional metal waveguide is used for millimeter-wave transmission, then low signal loss is achieved, but the volume becomes large and processing time increases
Solution Approach 1:
The patent changes the physical parameters of the waveguide by using a substrate with integrated cavities and metal layers instead of conventional metal waveguides. This structural parameter change enables compact size while maintaining low signal loss for millimeter-wave transmission through optimized cavity dimensions and metal layer configurations.
Solution Approach 2:
The patent employs a composite structure combining substrate material, cavity spaces, and metal layers to create a waveguide that achieves both compact volume and low signal loss. The composite design integrates multiple materials with complementary properties to resolve the contradiction between size and performance.
2Manufacturing precision
If precise processing is performed on metal waveguides for high-frequency waves, then signal transmission quality is improved, but manufacturing time increases significantly
Solution Approach 1:
The patent segments the waveguide structure into a substrate with integrated cavities and metal layers, allowing parallel processing of multiple components. This segmentation enables simultaneous fabrication of multiple waveguide elements, reducing overall manufacturing time while maintaining precision through standardized cavity and metal layer patterns.
Solution Approach 2:
The patent replaces complex mechanical processing of metal waveguides with a fabrication process involving substrate preparation, cavity formation, and metal layer deposition. This substitution of mechanical machining with deposition and patterning processes significantly reduces processing time while achieving high manufacturing precision.
3Adaptability or versatility
If surface integrated waveguide technology using vias is used, then waveguide functionality is achieved, but integration with semiconductor chips becomes complex
Solution Approach 1:
The patent merges the waveguide structure with the semiconductor chip substrate by integrating cavities and metal layers directly into the substrate. This merging eliminates the need for separate via-based integration, simplifying the overall device structure while maintaining waveguide functionality and reducing integration complexity.
Solution Approach 2:
The patent designs the substrate to serve multiple functions: as the structural base, as the waveguide cavity container, and as the mounting platform for semiconductor chips. This multi-functionality reduces the number of separate components needed, thereby simplifying integration while maintaining full waveguide functionality.
Data Source
AI summary
A waveguide package and a method for manufacturing the same are disclosed. The waveguide package includes a package structure including a waveguide opened toward one side surface of a substrate, a semiconductor chip mounted on one surface of the package structure and configured to output an electrical signal to the waveguide. Since an interior of the waveguide is filled with air, electrical loss of the waveguide is minimized. The cavity is formed by processing the substrate made of photosensitive glass. Accordingly, the waveguide may be accurately formed. An electronic circuit may also be formed at the waveguide package. Accordingly, it may be possible to provide a waveguide package enhanced in degree of integration.