Optical Waveguides in Glass Substrate for MCP Interconnects
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Solution Overview
Problem
Current semiconductor packaging technologies, relying on electrical interconnects, are limited in die-to-die reach and bandwidth due to high density I/O constraints, restricting the number of dies that can be integrated and limiting scalability in multichip packages (MCPs).
Innovation Solution
The implementation of optical interconnects using optical waveguides within glass layers, enabling high-speed communication between non-adjacent dies through laser-written waveguides and hermetic or eutectic bonding of glass layers, which increases die reach and bandwidth, and supports non-straight interconnects for flexible routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrical interconnects are used for die-to-die communication, then the packaging structure is simple and easy to manufacture, but the die-to-die reach is limited and bandwidth is constrained due to high density I/O constraints
Solution Approach 1:
The patent replaces electrical interconnects with optical waveguides for die-to-die communication. This substitution enables significantly longer die-to-die reach and higher bandwidth while reducing the density of I/O constraints on the dies themselves, as optical signals can travel longer distances through the glass substrate without degradation.
Solution Approach 2:
The patent embeds optical waveguides within the glass substrate at multiple depths and orientations, creating a three-dimensional optical interconnect network. This allows non-adjacent dies to be connected through the substrate volume, dramatically extending the effective die-to-die reach beyond what planar electrical interconnects can achieve.
2Quantity of substance
If electrical interconnects are used for die communication, then the I/O density requirements are high, but the bandwidth and die count integration are limited
Solution Approach 1:
The patent substitutes optical waveguides for electrical interconnects, enabling much higher bandwidth communication between dies. The optical interconnects provide greater capacity for data transmission, allowing more dies to be integrated into the package with improved overall productivity and throughput.
Solution Approach 2:
The glass substrate with embedded waveguides acts as an intermediary optical network that connects multiple dies. This intermediary structure enables high-bandwidth communication between non-adjacent dies without requiring high I/O density on each die, as the optical signals can be routed through the substrate to reach distant dies efficiently.
3Productivity
If more dies are integrated into the package, then the computational capability increases, but the I/O constraints and packaging complexity increase
Solution Approach 1:
The patent uses three-dimensional waveguide routing within the glass substrate to connect dies in a scalable manner. By utilizing the volume of the substrate rather than just the surface, the packaging complexity is managed more efficiently, allowing more dies to be integrated without proportionally increasing the difficulty of interconnect routing.
Solution Approach 2:
The glass substrate with embedded waveguides serves as a universal interconnect platform that can accommodate multiple dies with varying I/O requirements. The optical network provides a standardized interface for die-to-die communication, simplifying the packaging process even as the number of integrated dies increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach dramatically increases die count integration and I/O bandwidth, allowing for longer die-to-die connections and reduced link requirements, while reducing power consumption and enhancing MCP scalability by a factor of five compared to electrical interconnects.
Implementation Method 1
Optical waveguides within a glass substrate to optically couple dies attached to the glass substrate
Implementation Method 2
laser-written waveguides
Data Source
AI summary
Embodiments described herein may be related to apparatuses, processes, and techniques directed to optical interconnects and optical waveguides within a glass layer of a semiconductor package, where dies that are physically and optically coupled with the glass layer are optically coupled with each other via the optical waveguides. One or more reflectors may be used to direct the optical pathway through the glass layer. Other embodiments may be described and/or claimed.