Glass Waveguide Photoelectric Packaging for Low-Loss PCB Interconnects

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Solution Overview

Problem

The traditional data center switch system faces challenges due to high transmission line losses from long PCB routing distances, leading to increased power consumption and limited performance improvement, and polymer waveguides suffer from poor temperature stability, high transmission loss, and poor refractive index matching with optical fibers, resulting in high optical coupling loss.

Innovation Solution

A photoelectric hybrid device utilizing a glass waveguide with a glass substrate containing a glass waveguide and conductive traces, integrated with a photoelectric chip, where optical signals are transmitted through the glass waveguide and electrical signals through conductive traces, enhancing optical path coupling and transmission efficiency by leveraging the glass waveguide's good chemical durability and refractive index matching with optical fibers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If polymer waveguide is used, then manufacturing process compatibility with PCB is improved, but temperature stability deteriorates

Engineering Contradiction:
Improvemanufacturing process compatibilityVSAvoidtemperature stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent uses glass as the substrate material and polymer as the waveguide material, creating a composite structure that combines the manufacturing advantages of polymer with the thermal stability of glass. This composite approach allows the waveguide to be fabricated using PCB-compatible processes while the glass substrate provides the necessary temperature stability.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If polymer waveguide is used, then manufacturing process compatibility with PCB is improved, but transmission loss deteriorates

Engineering Contradiction:
Improvemanufacturing process compatibilityVSAvoidtransmission loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The glass substrate with polymer waveguide creates a composite structure where the glass provides low transmission loss properties while the polymer enables PCB-compatible manufacturing. The glass substrate has superior optical transmission characteristics that reduce energy loss during signal transmission.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If polymer waveguide is used, then manufacturing process compatibility with PCB is improved, but refractive index matching with optical fiber deteriorates

Engineering Contradiction:
Improvemanufacturing process compatibilityVSAvoidrefractive index matching
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The glass substrate provides refractive index properties that match well with optical fibers, while the polymer waveguide layer maintains manufacturing compatibility with PCB processes. This composite structure bridges the gap between manufacturing ease and optical coupling efficiency.

Inventive Principle:
Principle #40Composite materials

4Ease of operation

If long PCB routing distance is used, then optical module assembly on PCB edge is simplified, but transmission line loss deteriorates

Engineering Contradiction:
Improveoptical module assemblyVSAvoidtransmission line loss
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The patent replaces the mechanical/electrical PCB routing system with an optical waveguide system. Instead of using long electrical traces on PCB that cause transmission loss, the invention uses glass waveguides that guide optical signals directly from the optical module to the switch chip, eliminating the high-loss electrical transmission path.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves optical path coupling and transmission efficiency by using glass waveguides, offering better chemical durability and refractive index matching, reducing transmission loss, and enhancing the mechanical stability and reliability of the packaging structure.

Implementation Method 1

an optical connection port of the photoelectric chip is arranged opposite to a first end of the glass waveguide, so that light passing through the first end enters the optical connection port

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

the coupling degree of optical path and optical transmission efficiency are improved by adopting the beneficial features of glass waveguide, i.e., good chemical durability and good refractive index matching with optical fiber

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS12571975B2Photoelectric hybrid device based on glass waveguide and manufacturing method thereof
Publication Date: 2026.03.10 SHENNAN CIRCUITS
  • US12571975B2 patent drawing
  • US12571975B2 patent drawing

AI summary

Provided are a photoelectric hybrid device based on glass waveguide and manufacturing method thereof. The device comprises a first organic substrate, a glass substrate and a photoelectric chip; an inner side of an upper surface of the glass substrate is provided with a glass waveguide and an electrical interconnection structure communicating the upper surface and a lower surface of the glass substrate; the photoelectric chip is installed on an outer side of the upper surface of the glass substrate, an electrical connection port of the photoelectric chip is connected with the electrical interconnection structure, and an optical connection port of the photoelectric chip is arranged opposite to a first end of the glass waveguide; and the lower surface of the glass substrate is connected with the first organic substrate, and also connected with the first conductive trace arranged in the first organic substrate through the electrical interconnection structure.