Glass Wiring Substrate Structure for Mini LED Trace Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing Mini LED backlight substrates, particularly PCB base substrates, face issues with poor heat dissipation and warping, while glass base substrates offer better prospects but require improved adhesion and protection for metal traces to prevent oxidation and water-oxygen corrosion.
Innovation Solution
A wiring substrate design featuring a base substrate with stacked metal traces and an organic insulating layer, where the metal traces have a specific angle and contact area configuration, and an oxidization protective layer, along with a reflective layer, to enhance adhesion and protect against corrosion, and a manufacturing method involving electroplating and screen printing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If PCB base substrate is used for Mini LED backlight, then ease of manufacture is improved, but heat dissipation performance deteriorates and warping occurs
Solution Approach 1:
The patent changes the material parameter of the base substrate from PCB to glass, which fundamentally alters the thermal properties. Glass substrate provides superior heat dissipation capability compared to PCB, directly resolving the heat dissipation issue while maintaining manufacturability through established glass substrate processing techniques
2Ease of manufacture
If PCB base substrate is used for Mini LED backlight, then ease of manufacture is improved, but structural stability deteriorates due to warping
Solution Approach 1:
The patent changes the material parameter of the base substrate from PCB to glass, which fundamentally alters the dimensional stability properties. Glass substrate provides superior structural stability and resistance to warping compared to PCB, directly resolving the structural stability issue while maintaining manufacturability
3Temperature
If glass base substrate is used for Mini LED backlight, then heat dissipation performance is improved, but adhesion of metal traces deteriorates
Solution Approach 1:
The patent applies a multi-layer composite structure on the glass substrate, including organic insulating layer, metal trace layers, reflective layer, and protective layer. This composite material system enhances the adhesion of metal traces to the glass substrate while preserving the superior heat dissipation performance of glass
Solution Approach 2:
The patent introduces an organic insulating layer as an intermediary between the glass substrate and metal traces. This intermediary layer improves adhesion and provides electrical insulation, resolving the adhesion issue while maintaining the heat dissipation advantages of the glass substrate
4Temperature
If glass base substrate is used for Mini LED backlight, then heat dissipation performance is improved, but corrosion resistance of metal traces deteriorates
Solution Approach 1:
The patent applies a multi-layer composite structure including reflective layer and protective layer over the metal traces. These protective layers shield the metal traces from water and oxygen exposure, preventing corrosion while maintaining the heat dissipation performance of the glass substrate
Solution Approach 2:
The patent introduces protective layers as intermediaries between the metal traces and the environment (water and oxygen). These protective layers prevent direct contact between corrosive elements and metal traces, resolving the corrosion resistance issue while preserving the heat dissipation advantages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves adhesion between metal traces and the substrate, reduces the risk of trace detachment, and protects against water-oxygen corrosion, enhancing the performance and reliability of Mini LED backlight products.
Implementation Method 1
a second metal layer formed on a first metal layer
Implementation Method 2
an organic insulating layer disposed in the same layer as the metal traces
Implementation Method 3
a reflective layer to enhance adhesion and protect against corrosion
Implementation Method 4
an oxidization protective layer, along with a reflective layer, to enhance adhesion and protect against corrosion
Data Source
AI summary
A wiring substrate, a manufacturing method thereof, a light-emitting panel, and a display device are disclosed. The wiring substrate includes: a base substrate (11); and a plurality of metal traces (50) and an organic insulating layer (13), which are located at one side of the base substrate. The metal traces (50) each comprise a first metal layer (141) and a second metal layer (151), which are stacked; the first metal layer (141) is located between the second metal layer (151) and the base substrate (11); an angle between a side wall of the second metal layer (151) and the base substrate (11) is greater than or equal to 90°; the area of a contact face between each of the metal traces (50) and the base substrate (11) is greater than or equal to the area of the surface of the second metal layer (151) opposite the first metal layer (141).