Glasses Frame Encapsulation Using Plasticized Cellulose Acetate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for encapsulating electronic devices within glasses frames face issues such as temperature sensitivity, delamination, and poor aesthetic quality, leading to potential cracks and breakage.
Innovation Solution
A method using a mixture of plasticized cellulose acetate with a solvent, which undergoes a process called Complex Solvent Block, allowing for low-temperature sintering and encapsulation without prepping surfaces, ensuring flexibility and complete encapsulation without residual cavities, and using a protective material like polyurethane for added protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high temperature and pressure are applied to join cellulose acetate sheets, then the sheets can be cemented together, but electronic components cannot withstand temperatures exceeding 100°C
Solution Approach 1:
The patent changes the joining parameters by using a solvent-based process instead of high-temperature heating. The solvent softens the cellulose acetate sheets at lower temperatures, allowing bonding without exceeding 100°C, thus protecting electronic components from thermal damage while achieving sufficient joining strength.
Solution Approach 2:
The patent introduces a solvent as an intermediary substance to facilitate joining. The solvent acts as a mediator that softens the polymer sheets and enables bonding at low temperatures, eliminating the need for direct high-temperature application that would harm electronic components.
2Manufacturing precision
If radio frequency heating is used to pressurize and heat plastic material, then precise heating of superficial area is achieved, but delamination and marks are left causing cracks and breakage
Solution Approach 1:
The patent uses a solvent as an intermediary to achieve uniform softening without localized overheating. The solvent distributes heat evenly throughout the material, preventing the delamination and marks caused by radio frequency heating, while maintaining manufacturing precision in the joining process.
Solution Approach 2:
The patent replaces the mechanical/radio frequency heating system with a chemical solvent-based system. This substitution eliminates the harmful effects of concentrated heating while maintaining the ability to precisely control the softening process, preventing frame damage.
3Reliability
If material is hollowed out to create cavity for electronic elements, then encapsulation is achieved, but delamination and marks of poor aesthetic quality are left
Solution Approach 1:
The patent performs preliminary softening of the cellulose acetate sheets using solvent before forming the encapsulation structure. This preliminary action allows the material to be shaped around electronic components without creating hollow cavities or surface marks, achieving both good encapsulation quality and aesthetic surface finish simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more resistant, flexible, and aesthetically pleasing encapsulation that prevents delamination and damage to electronic components, maintaining their functionality and integrity.
Implementation Method 1
the subsequent application of pressure in the direction perpendicular to a bonding plane and the application of a temperature adapted to allow the solvent to evaporate and the acetate to sinter, cementing the two sheets together
Implementation Method 2
the application of a temperature adapted to allow the solvent to evaporate and the acetate to sinter, cementing the two sheets together
Implementation Method 3
applying sufficiently high temperatures and pressures to bring the plastic material at the two sheet surfaces above melting point. This allows the cellulose acetate to solidify into a single block once the temperature is lowered at the end of coupling
Data Source
AI summary
Glasses frame including at least one portion of an electronic device encapsulated inside at least one element of the glasses frame, wherein at least one element of the glasses frame includes a plasticized cellulose acetate mixture, wherein the composition of the mixture provides that at least one portion of the at least one element inside which at least one portion of the electronic device is encapsulated, having at least a negligible mass percentage of at least one solvent.

