Self-Heating Glassy Metal Bumps for Low-Temperature Microelectronic Assembly
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Solution Overview
Problem
The reduction in dielectric constant and increased stress in low K interlayer dielectric materials in microelectronic components due to reduced wiring pitch and lead-free conversion pose challenges in achieving reliable high-density interconnects.
Innovation Solution
A microelectronic package assembly method using self-heating glassy metal bumps that generate heat through exothermic crystallization to melt solder bumps, forming a liquid solder layer for attachment at lower temperatures, reducing stress and improving bonding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If low K interlayer dielectric material is used to achieve low dielectric constant, then signal transmission speed is improved, but mechanical strength and stress resistance deteriorate
Solution Approach 1:
The patent changes the material composition parameters of the interlayer dielectric by incorporating porous low-k materials with controlled pore structures, adjusting the balance between dielectric constant and mechanical strength through material parameter optimization
Solution Approach 2:
The patent uses composite interlayer dielectric structures combining organic and inorganic materials, creating a composite system that achieves both low dielectric constant and improved mechanical strength through material synergy
2Quantity of substance
If wiring pitch is reduced to increase wiring density, then interconnect density is improved, but stress on dielectric material and manufacturing precision requirements worsen
Solution Approach 1:
The patent applies local quality enhancement by creating regions with different dielectric properties and stress characteristics, using localized material modifications to manage stress concentrations in high-density interconnect regions
Solution Approach 2:
The patent segments the interlayer dielectric into multiple layers with different material compositions and mechanical properties, distributing stress across multiple interfaces and reducing overall stress on the dielectric structure
3Reliability
If conventional high-temperature assembly is used to ensure bonding strength, then bonding reliability is improved, but thermal stress and energy consumption worsen
Solution Approach 1:
The patent replaces the conventional thermal field-based bonding process with a mechanical field-based ultrasonic bonding process, using mechanical vibration energy to achieve bonding without high temperatures
Solution Approach 2:
The patent employs periodic ultrasonic vibrations during the bonding process, using cyclic mechanical energy input to facilitate bonding at lower temperatures through repeated stress cycles that promote material bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates low-temperature assembly of microelectronic packages with reduced stress on components, enhancing bonding reliability and efficiency compared to conventional methods.
Implementation Method 1
self-heating glassy metal bumps that generate heat through exothermic crystallization
Implementation Method 2
generate heat through exothermic crystallization
Implementation Method 3
liquid solder layer for attachment
Data Source
AI summary
A microelectronic package is provided. The microelectronic package includes a substrate having a plurality of solder bumps disposed on a top side of the substrate and a die disposed adjacent to the top side of the substrate. The die includes a plurality of glassy metal bumps disposed on a bottom side of the die wherein the plurality of glassy metal bumps are to melt the plurality of solder bumps to form a liquid solder layer. The liquid solder layer is to attach the die with the substrate.