Global-Shutter Pixel Recess Structure for Crosstalk Blocking

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Solution Overview

Problem

Global-shutter image sensors are susceptible to parasitic crosstalk due to stray light reaching the pixel's storage node, which distorts the resulting pixel values and affects image quality.

Innovation Solution

The design includes a semiconductor substrate with recessed regions and a photodiode region having specific dopant concentrations and structures, along with a dielectric and conductive fill, to prevent stray light from reaching the storage node, utilizing recessed regions and a protrusion to block parasitic light and enhance charge transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a global-shutter image sensor uses a conventional flat pixel structure, then the device complexity is low, but parasitic crosstalk occurs due to stray light reaching the storage node during integration period

Engineering Contradiction:
Improvepixel value accuracyVSAvoidpixel structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The pixel structure is segmented by introducing two recessed regions (first and second recessed regions) that divide the path between the photodiode region and storage node. These recessed regions create physical separation zones that block stray light from reaching the storage node during the integration period, thereby reducing parasitic crosstalk while maintaining global-shutter functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a conventional two-dimensional flat pixel structure to a three-dimensional structure by etching recessed regions into the semiconductor substrate. This vertical dimensionality change creates depth-based light blocking without significantly increasing lateral footprint, effectively preventing parasitic crosstalk while preserving pixel array density.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the photodiode region uses uniform dopant concentration, then the manufacturing process is simple, but charge transfer efficiency to the storage node is insufficient

Engineering Contradiction:
Improvecharge transfer efficiencyVSAvoiddoping process complexity
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The photodiode region employs non-uniform dopant concentration with a first doped section having higher dopant concentration near the storage node interface and a second doped section with lower dopant concentration toward the front surface. This local variation in doping concentration optimizes charge transfer efficiency at critical interfaces while reducing noise in other regions, achieving enhanced productivity without excessive manufacturing complexity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces parasitic crosstalk, improving image quality by preventing stray light from affecting the storage node and ensuring accurate pixel value generation.

Implementation Method 1

each pixel produces photo-generated charge in response to illumination incident thereon

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Implementation Method 2

During integration period, light that reaches a pixel's storage node, or immediate surroundings, generates charges that change the amount of photo-generated charge at the storage node

Methodology Applied
Scientific EffectLight blocking through recessed structure: Absorption (EM radiation)

Data Source

PatentUS20240145497A1Global-shutter pixel
Publication Date: 2024.05.02 OMNIVISION TECHNOLOGIES INC
  • US20240145497A1 patent drawing
  • US20240145497A1 patent drawing
  • US20240145497A1 patent drawing

AI summary

A global-shutter pixel includes a semiconductor substrate that has a storage node and a photodiode region. A front surface of the substrate has a first recessed region between the photodiode region and the storage node in a first direction parallel to the front surface, and a second recessed region between the first recessed region and the storage node in the first direction. The first and second recessed regions extend into the substrate to a respective first recess-depth and a second recess-depth that exceeds the first recess-depth. The photodiode region includes (i) a first doped-section spanning a depth-range and having a first dopant concentration, and (ii) a second doped-section between the front surface and the first doped-section and having a second dopant concentration that is less than the first dopant concentration. The first doped-section includes a protrusion that extends at least partially beneath the first recessed region in the first direction.