Continuous Glucose Sensor Via-Hole Layout for Stable Miniaturization
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Solution Overview
Problem
Conventional continuous glucose monitoring systems face challenges in minimizing sensor unit size due to complex electrode layer structures, which are difficult to manufacture and prone to defects, limiting their stability and accuracy.
Innovation Solution
A sensor unit design that connects electrode layers on opposite surfaces of a circuit board through via holes, with electrode connection layers deposited on the via holes' inner surfaces, allowing for a simplified and stable structure that maintains electrical connectivity even if one layer is damaged.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrode layers are arranged on the same surface of the circuit board, then electrical connection is achieved, but the width of the circuit board increases and the structure becomes complex
Solution Approach 1:
The patent transitions from arranging electrode layers on the same surface (2D plane) to arranging them on opposite surfaces of the circuit board (3D spatial arrangement). This dimensional change allows electrical connection without increasing board width or structural complexity, as the via holes provide the connection path through the board thickness rather than requiring lateral expansion.
Solution Approach 2:
The electrode connection layers are nested within the via holes that penetrate through the circuit board. The via holes act as conduits that contain and protect the connection layers, creating a compact nested structure that eliminates the need for separate external connection structures.
2Reliability
If via holes are filled with electrode connection layer, then electrical connection is established, but manufacturing defects occur during the filling process
Solution Approach 1:
The patent extracts the electrode connection layer from the via hole filling process and places it only on the inner circumferential surface of the via holes. This eliminates the complex filling process and associated defects while maintaining electrical connection, as the connection layer is formed by deposition on the via hole walls rather than by filling the entire via hole volume.
Solution Approach 2:
The electrode connection layer is applied locally only to the inner circumferential surface of the via holes rather than filling the entire via hole. This localized application simplifies manufacturing by avoiding the complexities of complete via filling while still providing sufficient electrical connection through the circumferential surface contact.
3Device complexity
If single via hole is used for electrode connection, then structure is simple, but connection stability is reduced when damage occurs
Solution Approach 1:
The patent divides the electrical connection path into multiple discrete via holes instead of using a single via hole. This segmentation creates redundant connection paths, so if one via hole or its connection layer is damaged, electrical connection is maintained through the remaining via holes, thereby improving overall connection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a minimized and stable sensor unit structure with improved connectivity and reduced manufacturing defects, enhancing usability and accuracy of blood glucose measurements.
Implementation Method 1
forming an electrode connection layer formed at the via holes by depositing the electrode connection layer on an inside circumferential surface of the via holes
Data Source
AI summary
The present disclosure relates to a continuous blood sugar measuring sensor member, wherein: since an electrode layer formed on one surface of a substrate is connected to a sensor contact point part on the other surface of the substrate through a via hole and thus two electrode layers may be formed on different opposite surfaces without having to be formed on the same surface of the substrate, the width of the substrate may be further reduced and an overall minimized and simplified structure may be ensured; since an electrode connection layer formed at the via hole is not formed in a shape of filling the via hole but is formed only on the inner circumferential surface, a filling defect occurring in a process of filling the via hole and a fault in electrical connection according thereto may be prevented and thus a more stable structure may be ensured; and since a plurality of via holes are formed, despite damage to or the occurrence of a defect in an electrode connection layer formed at one of the via holes, electrical connection is maintained by electrode connection layers formed at the remaining via holes, and thus more stable performance may be maintained.