Glue Application Head with Slit for Uniform Bonding
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Solution Overview
Problem
Conventional glue dispensing methods for bonding silicon rods result in unstable bonding quality, damaged wafers during slicing, and difficulties in applying glue at corners, leading to uneven glue layers and waste.
Innovation Solution
A glue application head with a strip-shaped slit is used to apply glue in a predetermined line width, forming a consistent glue path, and a gluing mechanism with a measuring instrument ensures uniform glue thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glue dots are dispensed to form a linear glue path, then bonding is achieved, but the bonding quality becomes unstable and wafer damage occurs during slicing
Solution Approach 1:
The glue application head is divided into multiple independent glue outlets (first, second, third, and fourth outlets) arranged at different positions. Each outlet applies glue to a specific region, allowing precise control over glue distribution. This segmentation enables the glue to be applied at corners and along edges effectively, solving the problem of unstable bonding quality and wafer damage during slicing.
2Ease of operation
If glue dots are dispensed manually at corners, then corner coverage is achieved, but time is wasted and glue layer thickness becomes uneven
Solution Approach 1:
The glue application head is pre-configured with multiple outlets positioned at specific locations including corners and along the material plate. The outlets are arranged to apply glue in a predetermined pattern that includes corner coverage. This preliminary arrangement of glue outlets eliminates the need for manual secondary application at corners, saving time and ensuring uniform glue layer thickness from the initial application.
3Object-generated harmful factors
If repeated cleaning is performed to remove residual glue, then equipment cleanliness is maintained, but material plate thickness is reduced
Solution Approach 1:
The invention extracts and removes the source of residual glue problems by using a controlled glue application system with defined outlets and a predetermined glue path. The glue is applied in a controlled manner that prevents excessive accumulation and overflow. This extraction of the uncontrolled dispensing method eliminates the need for repeated cleaning, thereby preserving material plate thickness.
4Reliability
If a linear glue path is formed by glue dots, then bonding is achieved, but the method is sensitive to flatness, roughness, and temperature variations
Solution Approach 1:
The glue application head incorporates multiple outlets that can adapt to variations in the material plate surface. The outlets are positioned to accommodate flatness and roughness variations, and the system can adjust to temperature changes by maintaining proper glue flow. This dynamic configuration with multiple outlets at different positions makes the bonding process less sensitive to environmental factors while maintaining consistent bonding quality.
Data Source
AI summary
A glue application head for bonding is provided, including a main body. The main body includes a cavity for storing glue and a slit for applying the glue. Through the slit, the glue in the cavity is discharged from the glue application head to be applied on a workpiece to form a glue path with a predetermined line width. Not only can a glue layer with a uniform thickness be obtained, but also a problem of no glue coming out can be prevented. Accordingly, the glue application head has improved performance in coating the glue on the workpiece, and bonding ability of the glue can also be improved. A gluing mechanism with the glue application head and a bonding equipment including the gluing mechanism are also provided. A good fit is provided between the glue application head and the workpiece to prevent no dispensing and an overflow of the glue.