Glue-Dispensing Needle Cleaning Device with Precision Clearing Needle
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Solution Overview
Problem
Existing methods for cleaning glue-dispensing needles are either hazardous (using high-temperature carbonized glue) or ineffective and damaging (using thin tungsten wires) in removing residue, leading to potential user safety issues and reduced needle lifespan.
Innovation Solution
A cleaning device comprising a base, supporting unit, moving unit, adjusting unit, and clearing needle, which allows precise and safe removal of glue residue from the needle without scratching the inner surface, using a mechanism that adjusts the position of the clearing needle to effectively clean the needle's various holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature carbonized glue is used to clean the needle cavity, then cleaning effectiveness is improved, but user safety deteriorates and energy consumption increases
Solution Approach 1:
The patent replaces the thermal cleaning method (carbonized glue at high temperature) with a mechanical cleaning method (tungsten wire pulling through the needle). This substitution eliminates the safety hazards and energy consumption associated with high-temperature processing while maintaining cleaning effectiveness through mechanical action.
2Object-affected harmful factors
If tungsten wire is used to clean the needle cavity, then user safety is improved, but manufacturing precision deteriorates due to surface scratching
Solution Approach 1:
The patent changes the physical parameters of the cleaning tool by specifying precise dimensions for the tungsten wire (diameter of 0.03-0.08mm, length 1.05-1.1 times the needle length) and controlling its hardness (HV 200-400). These parameter optimizations ensure the wire is hard enough to clean effectively but not too hard to scratch the needle surface, thus preserving manufacturing precision.
3Object-affected harmful factors
If tungsten wire is used to clean the needle cavity, then user safety is improved, but reliability deteriorates due to needle damage
Solution Approach 1:
The patent optimizes the tungsten wire parameters including diameter (0.03-0.08mm), length (1.05-1.1 times needle length), and hardness (HV 200-400) to prevent needle damage. The controlled hardness and precise dimensions ensure effective cleaning without causing scratches or structural damage that would reduce needle service life.
4Device complexity
If conventional cleaning methods are used, then simplicity is maintained, but manufacturing precision deteriorates due to inaccurate cleaning
Solution Approach 1:
The patent specifies precise parameters for the tungsten wire (diameter 0.03-0.08mm, length 1.05-1.1 times needle length) and defines a specific cleaning process (pulling through the needle cavity multiple times). These parameter specifications transform a simple cleaning action into a precision-controlled process that accurately cleans all internal surfaces without damage.
Data Source
AI summary
A precision cleaning device for cleaning and clearing a glue-dispensing needle includes a base, a supporting unit disposed on the base, a moving unit movably connected to the supporting unit, a clearing needle connected to the moving unit and facing the supporting unit, and an adjusting unit connected to the moving unit. The adjusting unit adjusts a movement of the moving unit to drive the clearing needle to move towards the glue-dispensing needle on the supporting unit, allowing the clearing needle to pass through the glue-dispensing needle to completely clean and clear the glue-dispensing needle. The cleaning device also prolongs the service life of the glue-dispensing needle.