Protective Glue Groove Layout for Backlight Light Extraction
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Solution Overview
Problem
Electronic devices using direct-type backlight modules face issues such as poor light extraction efficiency, high cost, and complex manufacturing processes.
Innovation Solution
An electronic device design that includes a substrate with electronic components and a protective glue forming grooves between the components, where the distance between the component edges and the grooves satisfies a specific equation, enhancing light emission and simplifying manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If direct-type backlight modules are used to improve contrast and resolution, then display quality is improved, but light extraction efficiency deteriorates
Solution Approach 1:
The patent divides the protective glue layer into multiple regions separated by grooves, creating segmented light extraction paths. The grooves partition the glue layer into distinct sections, allowing light to be extracted through multiple interfaces rather than a single homogeneous layer, thereby improving overall light extraction efficiency while maintaining display quality
Solution Approach 2:
The patent introduces grooves with specific geometric characteristics (depth, width, spacing) at localized positions between electronic components. These grooves create regions with different optical properties compared to the surrounding protective glue, optimizing light extraction in specific areas where it is most needed while preserving the overall structural integrity and display performance
2Illumination intensity
If direct-type backlight modules are used to improve contrast and resolution, then display quality is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the protective glue layer and the light extraction structure into a single integrated component. The grooves are formed directly within the protective glue layer itself rather than requiring separate light extraction elements, reducing the number of manufacturing steps and simplifying the overall device structure while maintaining improved light extraction and display quality
Solution Approach 2:
The grooves are formed in the protective glue layer during the glue application process itself, before final assembly is completed. This preliminary formation of the light extraction structure eliminates the need for subsequent complex machining or assembly steps, thereby reducing manufacturing complexity while ensuring precise groove positioning for optimal light extraction
3Illumination intensity
If direct-type backlight modules are used to improve contrast and resolution, then display quality is improved, but cost increases
Solution Approach 1:
The protective glue layer serves multiple functions simultaneously: it provides mechanical protection for the electronic components, acts as an optical medium for light extraction enhancement through the groove structure, and maintains the structural integrity of the display assembly. This multi-functionality eliminates the need for separate protective and optical components, reducing material costs and simplifying manufacturing while achieving improved display quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves light extraction efficiency and reduces manufacturing complexity and costs, while maintaining the improved contrast and resolution of direct-type backlight modules.
Implementation Method 1
the protective glue is disposed on the substrate and the electronic components, and provided with at least one groove disposed between the two adjacent electronic components
Data Source
AI summary
An electronic device includes: a substrate; a plurality of electronic components disposed on the substrate, wherein there is a first pitch between two adjacent electronic components in a first direction; and a protective glue disposed on the substrate and the electronic components, and provided with at least one groove disposed between the two adjacent electronic components, wherein a distance between an edge of one of the two adjacent electronic components and the at least one groove satisfies an equation:0.3 mm≤D1<(P/2),where D1 is the distance between the edge of the one of the two adjacent electronic components and the at least one groove, and P is the first pitch.