Simultaneous Glue Application for Optical Polishing Tools
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Solution Overview
Problem
Existing methods for manufacturing optical grade polishing tools are not cost-effective, efficient, or productive in producing high-quality tools with excellent surface attachment and glue distribution.
Innovation Solution
A method using a pad printing machine to simultaneously apply glue to the elastically compressible body and polishing pad, allowing for efficient attachment with a combination of glue films, ensuring excellent cooperation and homogeneity, and enabling multiple applications for increased productivity and quality control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional sequential glue application methods are used, then the manufacturing process is simple to implement, but productivity is low and manufacturing precision is poor
Solution Approach 1:
The patent combines multiple glue application operations into a single integrated system. The movable platform simultaneously applies glue to multiple components (elastically compressible body and polishing pad) during one manufacturing cycle, eliminating sequential operations and dramatically improving productivity while maintaining controlled complexity through systematic integration
Solution Approach 2:
The patent employs a movable platform that can dynamically adjust its position and movement. The platform moves between different application positions and can accommodate various component arrangements, providing flexibility and adaptability that enhances both productivity and precision without requiring overly complex fixed infrastructure
2Manufacturing precision
If glue is applied to only one component, then the attachment is simple, but the surface attachment quality and homogeneity are insufficient
Solution Approach 1:
The patent applies glue to specific local areas of both components that require attachment. The system selectively applies glue to the polishing pad and elastically compressible body at precise locations, ensuring optimal surface attachment quality where needed while avoiding unnecessary glue application elsewhere
Solution Approach 2:
The patent applies glue to components before the actual assembly operation. By pre-applying glue to both the polishing pad and elastically compressible body, the system ensures proper glue distribution and working time for optimal attachment, improving precision while keeping the overall process straightforward
3Manufacturing precision
If multiple glue applications are performed sequentially, then homogeneity and quality control improve, but productivity decreases
Solution Approach 1:
The patent merges multiple glue application operations into a single simultaneous process. The movable platform applies glue to multiple components at the same time during one operational cycle, achieving the homogeneity and quality control of multiple applications without the time penalty of sequential execution, thereby maintaining high productivity
Solution Approach 2:
The patent ensures continuous productive action by applying glue to multiple components simultaneously in one continuous operation. The movable platform continuously moves between application positions without idle time, maintaining continuous useful action that delivers both high homogeneity and high throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in high-quality optical grade polishing tools with improved productivity and reproducibility, achieving excellent surface attachment and homogeneity while being simple, convenient, and economic to implement.
Implementation Method 1
A method using a pad printing machine to simultaneously apply glue to the elastically compressible body and polishing pad
Implementation Method 2
an elastically compressible body attached to the base and attached to polishing pad with said body sandwiched between the base and the polishing pad
Data Source
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AI summary
The method includes a step of applying glue including carrying out with a pad printing machine (35) a sequence of steps in which is driven a transfer pad (39A) from a glue taking position to an applying position in which the distal surface (43) of the transfer pad (39A) is in contact with one surface of one component (12) of the tool and in which is simultaneously driven another transfer pad (38A) from a glue taking position to an applying position in which the distal surface (43) of the another transfer pad (38A) is in contact with one surface of another component (13) of the tool, whereby said glue is applied simultaneously to said one surface of said one component (12) and to said one surface of said another component (13).