GOA Array Substrate Via Hole Regions for Scan Direction Adaptability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing fabrication processes for Gate Driver on Array (GOA) technology require different masks for forward and backward scanned array substrates, leading to low compatibility, high fabrication and design costs, and significant structural differences between the two scan methods.
Innovation Solution
An array substrate with pre-reserved forward and backward via hole regions allows for the formation of both forward and backward transmission channels using a via hole mask process, enabling the same substrate to be easily adapted for either scanning method, reducing design variations and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different masks are used for forward and backward scanned array substrates, then the fabrication process can accommodate both scan methods, but the fabrication compatibility is low and the fabrication and design costs are high
Solution Approach 1:
The patent applies universality by designing a single mask that can be used for both forward and backward scanned array substrates. The mask is configured with a first through-hole and a second through-hole that can accommodate different scanning directions, allowing the same mask to serve multiple functions and reduce the need for separate masks for each scan method.
Solution Approach 2:
The patent applies preliminary action by pre-configuring the mask with both first and second through-holes before the fabrication process begins. This preliminary design allows the mask to be ready for either forward or backward scanning without requiring subsequent modifications or additional masks, thereby simplifying the fabrication process and reducing costs.
2Adaptability or versatility
If different masks are used for forward and backward scanned array substrates, then both scan methods can be supported, but the design cost increases significantly
Solution Approach 1:
The patent applies universality by creating a universal mask design that supports both forward and backward scanning methods. This single mask replaces what would traditionally require two separate masks, thereby reducing design resources and eliminating redundant design work while maintaining support for multiple scan methods.
Solution Approach 2:
The patent applies merging by combining the functionality of two separate masks (one for forward scan, one for backward scan) into a single mask structure. The first and second through-holes are integrated into one mask, allowing both scanning directions to be accommodated without requiring separate design processes.
3Adaptability or versatility
If different masks are used for forward and backward scanned array substrates, then both scan directions can be fabricated, but the structural differences between the two methods become significant
Solution Approach 1:
The patent applies universality by designing a mask that maintains structural consistency while supporting both forward and backward scanning. The single mask with first and second through-holes ensures that the same structural pattern is applied regardless of scan direction, reducing structural differences between the two fabrication methods.
Data Source
AI summary
An array substrate, a display device and a method for fabricating an array substrate are disclosed. The array substrate comprises at least two Gate Driver on Array (GOA) elements and a Start Vertical (STV) signal line, a transmission channel between two of the adjacent GOA elements is formed by a via hole and a gate metal layer or a source/drain metal layer; a forward via hole region and a backward via hole region are disposed on the array substrate; the forward via hole region is for disposing a forward via hole for forming a forward transmission channel connecting an output of mth GOA element and an input of (m+1)th GOA element, a connection point connecting to the STV signal line is disposed on the first GOA element; the backward via hole region is for disposing a backward via hole for forming a backward transmission channel connecting an output of (m+1)th GOA element and an input of mth GOA element, a connection point connecting to the STV signal line is disposed on the last GOA element; m is an integer no less than 1.