GOA Signal Line Through Holes for Display Panel Burn-In
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Solution Overview
Problem
Screen burn-in in Gate on Array (GOA) display products is a common issue due to short-circuiting between signal lines on the TFT substrate and foreign objects causing electrostatic breakdown, which has not been effectively addressed.
Innovation Solution
The introduction of through holes in the GOA signal lines, strategically positioned and sized to reduce the area ratio and increase lateral and longitudinal distances between them, along with film pillars at the ends of these holes, to minimize the possibility of short-circuiting and foreign object interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are densely arranged in GOA signal lines to ensure electrical connection, then electrical connectivity is improved, but the risk of short-circuiting caused by foreign objects increases
Solution Approach 1:
The patent applies local quality by differentiating the treatment of through holes in different regions. In the first GOA signal line region, through holes are arranged with specific spacing rules (lateral distance ≥ 26μm, longitudinal distance ≥ 19μm, area ratio < 8%) to reduce foreign object intrusion risk. In the second GOA signal line region, through holes can be more densely arranged since the risk is lower. This regional differentiation resolves the contradiction by optimizing connectivity where needed while minimizing short-circuiting risk where foreign objects are more likely to enter.
Solution Approach 2:
The patent changes the parameters of through hole arrangement by establishing specific constraints: lateral distance between adjacent through holes ≥ 26μm, longitudinal distance ≥ 19μm, and area ratio of through holes to signal line < 8%. These parameter changes create sufficient spacing to prevent foreign objects from simultaneously contacting multiple through holes, thereby reducing short-circuiting risk while maintaining necessary electrical connectivity.
2Reliability
If the area ratio of through holes to GOA signal lines is increased to ensure adequate electrical connection, then electrical conductivity is improved, but the conduction area vulnerable to foreign objects increases
Solution Approach 1:
The patent establishes the parameter that the area ratio of through holes to GOA signal lines should be less than 8%. This parameter change optimizes the balance between electrical conductivity and vulnerability to foreign objects. The through holes are sized and spaced to provide sufficient electrical connection while limiting the total conduction area that could be compromised by foreign object intrusion.
Solution Approach 2:
The patent applies local quality by restricting the area ratio constraint specifically to the first GOA signal line region where foreign object intrusion is most likely. This allows adequate electrical connectivity in the high-risk region while permitting more flexible through hole arrangements in the second region, thereby resolving the contradiction between conductivity and vulnerability.
3Reliability
If lateral distance between adjacent through holes is reduced to increase connection density, then electrical connectivity is improved, but the likelihood of foreign objects causing short-circuiting increases
Solution Approach 1:
The patent changes the parameter of lateral distance between adjacent through holes to be at least 26μm in the first GOA signal line region. This parameter change creates sufficient lateral spacing to prevent foreign objects from bridging adjacent through holes, thereby reducing short-circuiting probability while maintaining adequate electrical connectivity through the distributed through hole arrangement.
Data Source
AI summary
The present application discloses an array substrate and a display panel, which includes gate on array (GOA) signal lines disposed in a film layer of the array substrate and driving signal lines disposed on a surface of the array substrate. The GOA signal lines are electrically connected to the driving signal lines by through holes. The through holes are correspondingly disposed on the GOA signal lines, and the through holes are disposed on the GOA signal lines according to an area ratio.