Gold-Complex Conductive Ink for Low-Temperature Film Formation
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Solution Overview
Problem
Existing conductive ink compositions based on metal nanoparticles or thermally unstable precursors are not compatible with substrates requiring low processing temperatures, limiting their use in flexible electronic devices.
Innovation Solution
Development of particle-free conductive ink compositions comprising gold(I) metal ions, alkylamine ligands, and solvents that form conductive metallic films at elevated temperatures below 300°C, using gold(I) amine complexes and specific alkylamine ligands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If particle-based or precursor-based conductive inks are used, then high electrical conductivity can be achieved, but the processing temperature becomes too high for substrate integrity
Solution Approach 1:
The patent changes the chemical composition parameters by using gold(I) complexes with specific alkylamine ligands (C3-C12) that decompose at lower temperatures than conventional precursors. This parameter change enables the ink to form conductive gold metal at temperatures below 300°C, resolving the contradiction between achieving high conductivity and maintaining substrate integrity at low processing temperatures.
Solution Approach 2:
The patent creates a composite ink formulation combining gold(I) metal ions with specific alkylamine ligands and solvent systems. This composite approach allows the ink to achieve both low processing temperature compatibility and high electrical conductivity, as the composite material decomposes cleanly at lower temperatures compared to conventional particle-based or precursor-based inks.
2Ease of manufacture
If conventional conductive inks are used, then processing can be performed, but substrate integrity is compromised at high temperatures
Solution Approach 1:
The patent modifies the thermal decomposition temperature parameter of the ink composition by selecting specific alkylamine ligands (C3-C12) that decompose at lower temperatures. This enables the ink to be processed at temperatures that do not compromise substrate integrity, while still achieving successful conductive film formation.
3Reliability
If nanoparticle-based gold inks are used, then conductivity is achieved, but shelf life and processing stability are limited
Solution Approach 1:
The patent uses a disposable precursor approach where the gold(I) complex with alkylamine ligand is designed to decompose completely during processing, leaving no residual particles that would affect long-term stability. This approach improves shelf life by eliminating the need for stable nanoparticle suspensions while maintaining high conductivity through complete decomposition to metallic gold.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compositions enable the formation of highly conductive films at low temperatures, maintaining substrate integrity and compatibility with flexible materials, offering improved shelf life and fine-scale feature printing.
Implementation Method 1
the particle-free conductive ink composition forms a conductive metallic film structure by curing at an elevated temperature
Data Source
AI summary
Conductive ink compositions comprising gold complexes are provided. Also provided are methods of preparing the conductive ink compositions, methods of forming conductive structures from the conductive ink compositions, and structures formed from the conductive ink compositions. The conductive ink compositions preferably comprise a gold metal, an alkylamine ligand, and a solvent. The conductive ink compositions can be used to form conductive structures comprising gold, for example by inkjet or other printing methods, at temperatures of 300° C. or less. Such conductive structures can be formed on a variety of substrates.