Gold Connection Layer PCB Design for Solder Absorption Prevention
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Solution Overview
Problem
As electronic devices become smaller and more integrated, there is an increasing difficulty in securing the reliability of printed circuit boards due to the miniaturization of components and the challenges of maintaining electrical connections.
Innovation Solution
A printed circuit board design that includes an insulating layer, a conductive pattern within the insulating layer, a skin layer with openings over the conductive pattern, and a connection layer made of gold that is partially surrounded by the skin layer, effectively connecting to the conductive pattern and preventing absorption by solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the printed circuit board and components is decreased to improve miniaturization, then the component size and device integration are improved, but the reliability of electrical connections deteriorates
Solution Approach 1:
The patent employs a composite material structure consisting of multiple layers including a skin layer, connection layer, insulating layer, and conductive pattern. This composite structure enhances connection reliability by distributing mechanical and electrical stresses across different material properties, preventing solder absorption and maintaining stable electrical connections even as overall device size decreases
Solution Approach 2:
The patent transitions from traditional planar connections to a multi-dimensional layered structure. The connection layer is positioned at a specific depth within the skin layer, creating a three-dimensional arrangement that improves connection stability. This vertical dimensionality allows for better mechanical support and electrical performance in miniaturized devices
2Reliability
If a connection layer is added to prevent solder absorption, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The patent merges multiple functions into the connection layer: it provides electrical connectivity, prevents solder absorption, and offers mechanical support. By combining these functions into a single integrated layer rather than separate components, the design achieves improved reliability without proportionally increasing overall device complexity
Solution Approach 2:
The connection layer serves multiple purposes simultaneously: it acts as an electrical conductor, a barrier against solder absorption, and a structural element within the skin layer. This multi-functionality reduces the need for additional separate components, balancing reliability improvement with controlled complexity
Data Source
AI summary
A printed circuit board includes: an insulating layer; a conductive pattern disposed within the insulating layer; a skin layer disposed on the insulating layer and having an opening on the conductive pattern; and a connection layer at least partially surrounded by the skin layer, disposed in the opening to connect to a portion of the conductive pattern, and containing gold (Au).