Gold Finger Alignment Marks for Narrow Edge Circuit Boards
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Solution Overview
Problem
Existing alignment marks on circuit boards occupy valuable space, leading to lower utilization ratios and an inability to meet the need for narrow edge configurations.
Innovation Solution
The use of gold fingers as alignment marks within the bonding area of circuit boards, which do not occupy additional space, allowing for more components to be accommodated and improving utilization ratios by differentiating in shape and optionally color to facilitate precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If alignment marks are provided outside the bonding area (at left and right sides or under the bonding area), then the alignment marks can be clearly distinguished and positioned, but the circuit board utilization ratio decreases and the board volume increases
Solution Approach 1:
The alignment mark is merged with the bonding area by using the gold fingers within the bonding area as the alignment mark. This combines the alignment function with the existing bonding structure, eliminating the need for separate alignment mark areas and thereby improving circuit board utilization ratio while maintaining positioning accuracy.
Solution Approach 2:
The gold fingers in the bonding area serve dual functions: they act as both bonding contacts for electrical connection and as alignment marks for positioning. This multi-functionality allows the same structure to fulfill multiple purposes, reducing the overall board area required while ensuring accurate alignment during the bonding process.
2Reliability
If alignment marks are provided outside the bonding area, then the alignment function is achieved, but the circuit board cannot accommodate more components and the edge becomes wider
Solution Approach 1:
The alignment mark functionality is merged into the bonding area's gold fingers, allowing the circuit board to use the same space for both alignment and bonding purposes. This enables more components to be accommodated on the board while maintaining reliable alignment functionality during the bonding process.
Solution Approach 2:
The gold fingers perform multiple functions simultaneously: they serve as bonding contacts for electrical connection and as alignment marks for positioning components. This multi-functionality increases the board's component accommodation capacity while ensuring reliable alignment without requiring additional dedicated alignment mark spaces.
Data Source
AI summary
The present invention discloses an alignment mark, a circuit board and a display device, the alignment mark is configured to position a to-be-bonded component during a bonding process and is constituted by first gold fingers provided in a bonding area of the to-be-bonded component. The alignment mark provided by the present invention is arranged in the bonding area and does not additionally occupy an effective area of the circuit board, which allows the circuit board to accommodate more components, thereby improving utilization ratio of the circuit board and meeting the need of narrow edge for the circuit board.