Gold Nanoparticle Conductive Compositions for High-Aspect-Ratio Printing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing metallic nanoparticle compositions for additive manufacturing, such as gold nanoparticle compositions, face challenges in achieving enhanced electrical conductivity, printability, and homogeneity in structures formed, particularly in high aspect ratio features.

Innovation Solution

A conductive composition comprising at least 75% by weight of gold nanoparticles with an average size of no greater than 100 nm, a polar solvent with a boiling point of at least 200°C, and optional additives like a polymeric dispersant and rheological agent, optimized to minimize low-boiling-point solvents, ensuring high gold concentration and stability for improved conductivity and printability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If gold nanoparticle composition is used for additive manufacturing, then electrical conductivity can be achieved, but printability and homogeneity in high aspect ratio features deteriorate

Engineering Contradiction:
Improveelectrical conductivityVSAvoidhomogeneity in structures
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the particle size parameter to 20-100 nm and uses a polar solvent with boiling point ≥200°C to improve both conductivity and printability. This parameter optimization allows the composition to maintain homogeneity while achieving high aspect ratio features with good electrical conductivity.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite material system combining gold nanoparticles with specific polar solvents (boiling point ≥200°C) and dispersants. This composite formulation improves both the electrical conductivity and printability, resolving the contradiction between conductivity and manufacturing precision.

Inventive Principle:
Principle #40Composite materials

2Reliability

If high gold nanoparticle concentration is used, then electrical conductivity is improved, but printability deteriorates

Engineering Contradiction:
Improveelectrical conductivityVSAvoidprintability
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent optimizes the particle size parameter to 20-100 nm and selects polar solvents with boiling points ≥200°C, which changes the rheological properties of the composition. This allows high gold concentration (75-95 wt%) to be achieved while maintaining printability through improved flow characteristics.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces polar solvents with high boiling points as intermediaries that mediate between the gold nanoparticles. These solvents act as a medium that allows high nanoparticle concentration while maintaining composition stability and printability during additive manufacturing.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If low-boiling-point solvents are used, then composition viscosity is reduced for better printability, but compositional stability and conductivity deteriorate

Engineering Contradiction:
ImproveprintabilityVSAvoidcompositional stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the solvent boiling point parameter to ≥200°C, which fundamentally alters the thermal stability and compositional stability of the system. This parameter change maintains viscosity suitable for printing while ensuring stability during the manufacturing process and post-printing handling.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent avoids using low-boiling-point solvents that would evaporate during processing, instead selecting high-boiling-point polar solvents that remain stable. This eliminates the problem of solvent loss and maintains compositional stability throughout the manufacturing process.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition enables enhanced electrical conductivity, printability, and homogeneity in structures formed, allowing for the creation of unique high aspect ratio features with improved mechanical and electrical characteristics.

Implementation Method 1

The polar solvent has a boiling point of at least 200°C. The composition comprises less than 5 percent by weight of any solvent having a boiling point of less than 200°C.

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 2

The composition comprises at least 75 percent by weight of gold nanoparticles... enabling enhanced electrical conductivity

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

An electrically conductive trace formed by sintering a conductive composition

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS20250223421A1Conductive compositions for additive manufacturing, additive manufacturing methods, electrically conductive traces produced therefrom, and electronic articles
Publication Date: 2025.07.10 XTPL SA
  • US20250223421A1 patent drawing
  • US20250223421A1 patent drawing
  • US20250223421A1 patent drawing

AI summary

Conductive compositions for additive manufacturing, additive manufacturing methods, electrically conductive traces produced therefrom, and electronic articles are provided. The composition comprises at least 75 percent by weight of gold nanoparticles and at least 2 percent by weight of a polar solvent based, all based on the total weight of the composition. The gold nanoparticles comprise an average particle size of no greater than 100 nm as measured with transmission electron microscopy. The polar solvent has a boiling point of at least 200° C. The composition comprises less than 5 percent by weight of any solvent having a boiling point of less than 200° C. based on the total weight of the composition.