Gold-Plated Optical Package Surfaces for Stronger Resin Adhesion
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Solution Overview
Problem
Optical semiconductor devices face challenges with adhesion to resin materials, particularly when using substrates with gold plating, which can be exacerbated by the presence of impurities like titanium oxide and phosphors, leading to reduced luminous flux and potential solder leakage.
Innovation Solution
A method involving a polyallylamine polymer treatment is applied to the outermost layer of metal structures in optical semiconductor devices, including gold, silver, or silver alloy platings, to enhance adhesion to resin materials, thereby improving reliability and preventing solder intrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gold plating is used on substrate surface, then resistance to sulfur is improved, but adhesion to resin materials deteriorates
Solution Approach 1:
A polyallylamine polymer coating is applied as an intermediary layer between the gold plating and resin materials. This polymer layer serves as a mediator that maintains the sulfur resistance of the gold plating while providing improved adhesion to the resin materials, thus resolving the contradiction between these two properties.
Solution Approach 2:
The invention creates a composite structure consisting of the gold plating layer combined with the polyallylamine polymer coating. This composite material system combines the sulfur-resistant properties of gold with the adhesion-enhancing properties of the polymer, simultaneously achieving both desired characteristics.
2Ease of manufacture
If impurities like titanium oxide and phosphors are present, then manufacturing cost is reduced, but adhesion to resin materials and luminous flux deteriorate
Solution Approach 1:
The polyallylamine polymer acts as an intermediary layer that isolates the resin materials from harmful impurities like titanium oxide and phosphors. This allows the presence of such impurities in the system without compromising adhesion or luminous flux, as the polymer barrier prevents their negative interactions.
Solution Approach 2:
The invention converts the potential harm of impurities into a benefit by using the polyallylamine polymer to selectively interact with or shield from these impurities. The polymer transforms the situation where impurities would normally cause adhesion failure into a scenario where adhesion is maintained despite impurity presence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method increases adhesion between metal structures and resin materials, maintaining high luminous flux and preventing solder leakage, even in the presence of impurities, thus enhancing the reliability and performance of optical semiconductor devices.
Implementation Method 1
a treatment step (1) of immersing in and/or applying a solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body
Data Source
AI summary
A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and/or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.