Gold Plating for Backside Connection Access
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Solution Overview
Problem
Current methods for accessing electrical traces in devices require separate independent steps and can be inefficient, particularly when using laser ablation, and do not allow for cost-effective and efficient manufacturing processes.
Innovation Solution
A backside connection access structure and method involving a gold layer between a substrate and a metal layer, where an opening in the substrate exposes the gold layer for forming electrical connections, enabling the use of additive and subtractive manufacturing processes and eliminating the need for separate access creation steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laser ablation is used to access electrical traces, then access to traces is achieved, but the manufacturing process becomes inefficient and requires separate independent steps
Solution Approach 1:
The patent combines the trace access creation with the existing metal layer formation process by using the same additive manufacturing steps to deposit gold and other metals that form both the electrical traces and the access structures, eliminating separate laser ablation steps and integrating multiple functions into a single manufacturing flow
Solution Approach 2:
The patent creates the access structure in advance during the metal layer formation process, before final device assembly, by pre-forming the gold layer and openings that will later provide trace access, thereby eliminating the need for post-assembly laser ablation operations
2Ease of manufacture
If separate independent steps are used to create access to electrical traces, then trace access is achieved, but manufacturing costs increase
Solution Approach 1:
The patent merges the access structure creation with the electrical trace formation by using identical additive manufacturing processes to deposit both the functional metal traces and the access gold layers, thereby reducing the total number of manufacturing steps and associated costs while simplifying the overall process complexity
Solution Approach 2:
The patent employs a universal additive manufacturing process that serves multiple functions: forming electrical traces, creating access structures, and depositing gold layers for both conductivity and access purposes, thereby eliminating the need for separate specialized processes and reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and allows for efficient access to metal layers in various devices, enhancing the production efficiency and versatility for different products by integrating the access creation with existing manufacturing processes.
Implementation Method 1
forming a gold layer over at least a portion of a substrate
Implementation Method 2
forming a metal layer over the gold layer
Data Source
AI summary
A backside connection access structure and method for manufacturing are described. The method including forming a gold layer over at least a portion of a substrate. The method also including forming a metal layer over the gold layer. And, the method includes forming an opening in the substrate to expose at least a portion of the gold layer.