Gold Sputtering Target with {110} Orientation for Uniform Film Thickness
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Solution Overview
Problem
Conventional gold sputtering targets face challenges in achieving uniform film thickness distribution, particularly for quartz oscillator devices, where miniaturization demands precise control over film thickness and mass variation to maintain frequency stability.
Innovation Solution
A gold sputtering target production method involving a target with a Vickers hardness of 40-60, crystal grain size of 15-200 μm, and preferential orientation of the {110} plane to the sputtering surface, ensuring uniform particle flight and improved film thickness distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional gold sputtering targets are used, then the basic sputtering function is achieved, but the film thickness distribution uniformity is insufficient for miniaturized quartz oscillator devices
Solution Approach 1:
The patent applies parameter changes by precisely controlling the Vickers hardness (40-60 HV) and crystal grain size (15-200 μm) of the gold sputtering target, as well as the preferential orientation of the {110} plane to the sputtering surface. These parameter optimizations enable uniform film thickness distribution while maintaining manufacturability through established metallurgical processes.
2Volume of moving object
If the quartz oscillator device is miniaturized, then the device size is reduced, but the influence of film thickness variation on frequency characteristics increases
Solution Approach 1:
The patent addresses miniaturization challenges by optimizing the gold target's physical parameters (hardness: 40-60 HV, crystal grain size: 15-200 μm, and {110} plane orientation). These parameter changes ensure that even in miniaturized devices where film thickness variation has greater influence, the sputtered gold film maintains uniform thickness and stable frequency characteristics.
3Productivity
If cylindrical sputtering target is used, then the usage rate of target material is improved, but the processing accuracy for cylindrical shape is difficult to achieve
Solution Approach 1:
The patent resolves the cylindrical target manufacturing challenge by specifying precise parameter ranges: Vickers hardness of 40-60 HV and crystal grain size of 15-200 μm with preferential {110} plane orientation. These parameter controls enable accurate cylindrical shape processing while maintaining high target material usage rates during sputtering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of gold films with enhanced uniformity in thickness distribution, reducing mass variation and improving frequency stability in quartz oscillator devices.
Implementation Method 1
forming a gold film on a film-forming base material through sputtering of the gold sputtering target
Data Source
AI summary
A production method for a gold sputtering target includes: producing a gold sputtering target which is made of gold and inevitable impurities and in which an average value of Vickers hardness is 40 or more and 60 or less, an average value of crystal grain size is 15 μm or more and 200 μm or less, and the {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.