Golf Ball IC Chip Protection Layer and Relaxation Design
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Solution Overview
Problem
Golf balls with built-in IC chips face damage during impact, core breaking, and communication failures due to stress concentration and heat sensitivity, especially when using high-fusion-point materials for the protection layer.
Innovation Solution
A golf ball design featuring an IC chip surrounded by a protection layer with a Shore D hardness of 60 or more, a relaxation layer with a thermoplastic elastomer-based material having a hardness difference of Shore D 20 or less from the core, and a core formed with a rubber composition, along with a cover, to prevent deformation, breaking, and heat-induced communication failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the hardness of the protection layer is increased to Shore D 60 or more to prevent IC chip damage during hitting, then the protection capability is improved, but the core may be broken or separated due to stress concentration caused by large hardness difference between the protection layer and the core
Solution Approach 1:
The patent introduces a relaxation layer as an intermediary component between the protection layer and the core. This relaxation layer has intermediate hardness properties that bridge the gap between the hard protection layer (Shore D 60 or more) and the softer core, preventing stress concentration and protecting the core from breaking or separating while maintaining the IC chip protection capability.
Solution Approach 2:
The patent employs a composite structure consisting of multiple layers with different material properties: a protection layer with high hardness (Shore D 60 or more) for IC chip protection, a relaxation layer with intermediate hardness to reduce stress concentration, and a core with lower hardness. This composite material approach allows each layer to perform its specific function while working together to resolve the contradiction between protection capability and core integrity.
2Temperature
If a material with high fusion point of 80° C. or more is used for the protection layer to maintain structural integrity, then the thermal stability is improved, but active type IC chips with built-in battery cells may fail due to heat sensitivity during production
Solution Approach 1:
The patent changes the temperature parameter for the protection layer material, specifying a curing temperature of 60° C. or less. This parameter change allows the use of lower curing temperature materials that are compatible with heat-sensitive active type IC chips containing battery cells, preventing communication failures during production while still providing adequate structural protection.
3Strength
If the hardness of the entire golf ball is increased to prevent core breaking, then the durability is improved, but the ball becomes excessively hard which may affect playability and comfort
Solution Approach 1:
The patent applies local quality by providing different hardness levels in different regions of the golf ball. The protection layer has high hardness (Shore D 60 or more) locally where IC chip protection is needed, while the core and cover maintain lower hardness for overall playability and comfort. This localized hardness distribution allows the ball to be durable without being excessively hard throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents IC chip damage, core breaking, and maintains golf ball durability while ensuring reliable communication by distributing stress and controlling the curing temperature of the protection layer.
Implementation Method 1
a relaxation layer surrounding an outer periphery of the protection layer; a core surrounding an outer periphery of the relaxation layer
Implementation Method 2
a protection layer surrounding an outer periphery of the IC chip, a curing temperature of the protection layer being 60° C. or less and the protection layer being formed with a material having a hardness of Shore D 60 or more
Data Source
AI summary
A golf ball includes: a radio frequency identification (RFID) tag including an IC chip and an antenna; a protection layer surrounding the outer periphery of the RFID tag; a relaxation layer surrounding the outer periphery of the protection layer; a core surrounding the outer periphery of the relaxation layer; and a cover surrounding the outer periphery of the core. The curing temperature of the protection layer is 60° C. or less, and the protection layer is formed with a material having a hardness of Shore D 60 or more. The relaxation layer is formed with a thermoplastic elastomer-based material having a hardness with a difference from a hardness of a surface of the core on a side contacting the relaxation layer of Shore D 20 or less.