Golf Ball Dual Radius Dimples for Drag Reduction
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Solution Overview
Problem
Current golf ball dimple designs, despite advancements in aerodynamic properties, still face limitations in maximizing flight distance and symmetry, particularly in maintaining distance and symmetry across different swing profiles and spin rates.
Innovation Solution
The use of dual radius dimples with specific cross-sectional profiles allows for shallower dimples while maintaining dimple volume, decoupling dimple depth from volume, and optimizing dimple placement in various regions of the golf ball to enhance aerodynamics and symmetry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If dimple depth is increased to maximize surface area coverage and improve aerodynamics, then flight distance is improved, but manufacturing precision and symmetry become more difficult to maintain
Solution Approach 1:
The patent changes the geometric parameters of dimples by introducing dual radius designs with specific depth-to-diameter ratios. By optimizing these parameters, the patent achieves improved flight distance through enhanced aerodynamics while maintaining manufacturing feasibility through standardized dimensional specifications that balance performance gains with production consistency.
2Reliability
If dimple patterns are optimized for specific swing profiles, then performance is improved for those profiles, but adaptability to other swing profiles and spin rates deteriorates
Solution Approach 1:
The patent creates a universal dimple pattern design that functions effectively across multiple swing profiles and spin rates. By using standardized dual radius dimple geometries with optimized depth-to-diameter ratios distributed in consistent patterns, the design achieves multi-functionality that maintains reliable performance whether the ball is struck with driver, iron, or wedge, and adapts to various spin rates generated by different swing styles.
3Loss of energy
If dimple volume is increased to reduce drag, then flight distance is improved, but dimple depth becomes excessive making manufacturing more difficult
Solution Approach 1:
The patent optimizes the parameter relationship between dimple depth and diameter by implementing dual radius designs with controlled depth-to-diameter ratios. This parameter optimization allows sufficient dimple volume to be achieved for effective drag reduction while keeping absolute depth values within manufacturable ranges, balancing aerodynamic performance with ease of production through standardized molding or machining parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved flight distance and symmetry, with increased carry distance and reduced drag, while maintaining consistent performance across varying swing conditions and spin rates.
Implementation Method 1
The use of dual radius dimples with specific cross-sectional profiles allows for shallower dimples while maintaining dimple volume, decoupling dimple depth from volume, and optimizing dimple placement in various regions of the golf ball to enhance aerodynamics and symmetry
Implementation Method 2
Recent developments in golf ball technology have been focused not only on the development of new golf ball materials and constructions, but also the improvement in their aerodynamic properties
Data Source
AI summary
A golf ball which, when orientated in the cross seam direction, has an equator at latitude 0°, and poles at latitude 90° and longitude 0°, an equator region Ex at latitudes 0 to 25°, a region Ei at longitudes 0 to 25°, a shoulder region Sx at latitudes from more than 25° to less than 65°, a region Si at longitudes from more than 25° to less than 65°, a pole region Px at latitudes 65° to 90°, and a region Pi at longitudes 650 to 90°. The ball dimple pattern has the following average dimple depths, hex in the region Ex, hsx in the region Sx, hpx in the region Px, hei in the region Ei, hsi in the region Si and hpi in the region Pi; and the ratios hex/hei, hsx/hsi and hpx/hpi are each greater than or equal to about 0.75 and less than or equal to about 1.20.