Golf Ball IC Chip Protection Layer and Relaxation

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Solution Overview

Problem

Golf balls with built-in IC chips face damage during impact, core breaking, and communication failures due to stress concentration and heat sensitivity of materials used in existing protection layers and RFID tags.

Innovation Solution

A golf ball design featuring a protection layer with a Shore D hardness of 60 or more, a relaxation layer with a thermoplastic elastomer-based material, and a core with a rubber composition, where the relaxation layer's hardness difference from the core is minimized to prevent stress concentration, and the protection layer cures at 80° C or less to avoid heat-induced communication failures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the hardness of the protection layer is increased to Shore D 60 or more to prevent IC chip damage during impact, then the protection capability against impact damage is improved, but the core may be broken or separated due to stress concentration from the large hardness difference between the protection layer and the core

Engineering Contradiction:
Improveprotection capabilityVSAvoidcore integrity
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

A relaxation layer made of thermoplastic elastomer is introduced between the high-hardness protection layer and the core. This intermediary layer has a hardness of Shore D 40 or less, creating a gradient structure that reduces stress concentration. The relaxation layer absorbs impact stresses and prevents them from concentrating on the core, thereby maintaining both the protection capability of the outer layer and the integrity of the core.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The golf ball structure employs different hardness levels in different regions: the protection layer has high hardness (Shore D 60 or more) for impact resistance, the relaxation layer has low hardness (Shore D 40 or less) for stress absorption, and the core has intermediate hardness. This localized quality distribution optimizes each region's function while preventing stress concentration at interfaces.

Inventive Principle:
Principle #3Local quality

2Temperature

If a material with high fusion point is used for the protection layer to prevent IC chip damage, then the thermal resistance is improved, but active type IC chips with built-in battery cells may fail due to heat sensitivity during production

Engineering Contradiction:
Improvefusion pointVSAvoidIC chip communication
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The relaxation layer made of thermoplastic elastomer serves as a thermal buffer between the high-temperature-resistant protection layer and the heat-sensitive active IC chip. This intermediary layer protects the battery cell from excessive heat during production while allowing the protection layer to maintain its high fusion point for structural integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the material parameter (hardness and thermal properties) of the relaxation layer to create a gradient structure. By selecting thermoplastic elastomer with specific properties (Shore D 40 or less), the structure can withstand high temperatures in the protection layer while protecting the heat-sensitive IC chip, thus resolving the contradiction between thermal resistance and chip reliability.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the hardness difference between the relaxation layer and the core is reduced to Shore D 20 or less to prevent stress concentration, then the core separation risk is reduced, but the overall durability may be compromised

Engineering Contradiction:
Improvecore-layer bondingVSAvoidoverall durability
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies local quality optimization by setting the hardness difference between the relaxation layer and core to Shore D 20 or less at the critical interface to prevent separation, while maintaining the protection layer's high hardness (Shore D 60 or more) for overall durability. This localized hardness control ensures both bonding reliability and structural strength.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The golf ball employs a composite structure with three distinct material layers: a hard protection layer (Shore D 60+) for impact resistance, a soft relaxation layer (Shore D 40-) made of thermoplastic elastomer for stress absorption and bonding, and a core with intermediate properties. This composite material approach allows each layer to contribute its optimal properties, achieving both core bonding reliability and overall durability.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents IC chip damage, core breaking, and communication failures, maintaining the durability of the golf ball while ensuring reliable RFID tag functionality.

Implementation Method 1

a relaxation layer surrounding an outer periphery of the protection layer; wherein the relaxation layer is formed with a thermoplastic elastomer-based material having a hardness with a difference from a hardness of a surface of the core on a side contacting the relaxation layer of Shore D 20 or less

Methodology Applied
Scientific EffectStress relaxation: Stress Relaxation

Implementation Method 2

a protection layer surrounding an outer periphery of the IC chip, a curing temperature of the protection layer being 80° C. or less and the protection layer being formed with a material having a hardness of Shore D 60 or more

Methodology Applied
Scientific EffectCuring:

Implementation Method 3

the relaxation layer is formed with a thermoplastic elastomer-based material having a hardness with a difference from a hardness of a surface of the core on a side contacting the relaxation layer of Shore D 20 or less

Methodology Applied
Scientific EffectViscoelasticity: Viscoelasticity

Data Source

PatentUS10751575B2Golf ball with built-in IC chip
Publication Date: 2020.08.25 BRIDGESTONE SPORTS CO LTD
  • US10751575B2 patent drawing

AI summary

A golf ball includes: a radio frequency identification (RFID) tag including an IC chip and an antenna; a protection layer surrounding the outer periphery of the RFID tag; a relaxation layer surrounding the outer periphery of the protection layer; a core surrounding the outer periphery of the relaxation layer; and a cover surrounding the outer periphery of the core. The curing temperature of the protection layer is 80° C. or less, and the protection layer is formed with a material having a hardness of Shore D 60 or more. The relaxation layer is formed with a thermoplastic elastomer-based material having a hardness with a difference from a hardness of a surface of the core on a side contacting the relaxation layer of Shore D 20 or less. The protection layer has an outer diameter of 3 to 16 mm, the relaxation layer has an outer diameter of 21 mm or less, and the core has a thickness of 8 mm or more.