Liquid Cooling Module with External Dual Pumps for GPU Heat Loads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat dissipation modules using liquid cooling methods face issues such as pump failure, inflexible pump positioning, and inadequate handling of heat generated by graphics processors, leading to poor overall performance and potential failure of peripheral power supply elements.
Innovation Solution
A heat dissipation device with a casing, base unit, and pump unit configuration that includes two pumps connected in series, allowing flexible pump placement and enhanced heat transfer through a water collecting chamber, action space, and heat transfer structure, with guide channels and bumps to optimize fluid flow and heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single pump is used in the liquid cooling system, then the device complexity is reduced, but the reliability decreases due to pump failure risk
Solution Approach 1:
The liquid cooling system is segmented into multiple independent pump units (first pump and second pump) that operate in parallel. Each pump can independently drive the cooling liquid through the system, allowing the system to maintain functionality even if one pump fails. This segmentation of the pumping function directly addresses the reliability issue by eliminating the single point of failure.
2Ease of operation
If the pump is positioned inside the casing, then the heat dissipation performance is improved, but the ease of operation deteriorates due to inflexible pump setting position
Solution Approach 1:
A connection structure serves as an intermediary between the pump and the casing, allowing the pump to be positioned externally while maintaining effective hydraulic connection to the internal cooling channels. This intermediary connection enables flexible pump installation locations without compromising the heat dissipation performance, as the cooling liquid flow path remains intact through the connection structure.
3Productivity
If a single cooling path is used, then the device complexity is reduced, but the heat dissipation performance deteriorates when handling large heat loads from graphics processors
Solution Approach 1:
The cooling system is divided into multiple parallel cooling paths, with each pump driving an independent cooling circuit. This segmentation allows the system to handle larger heat loads by distributing the thermal management burden across multiple flow paths, increasing overall heat dissipation capacity while maintaining manageable system complexity through modular architecture.
Solution Approach 2:
Multiple cooling paths are merged at the heat source interface (graphics processor cooling plates), where the cooling liquid from different paths converges to remove heat from the high-heat-generation components. This merging approach maximizes heat dissipation efficiency by combining the cooling capacity of multiple paths without requiring completely separate systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides flexible pump placement, reduces the risk of pump failure, and effectively manages high heat loads from graphics processors, resulting in improved heat dissipation performance and reduced risk of system failure.
Implementation Method 1
a heat transfer structure disposed on an inner side of the base unit for transferring a heat energy generated by a heat source in contact with an outer side of the base unit to a working medium in the action space
Implementation Method 2
a pump unit disposed outside the casing and the base unit and connected with the water inlet pipeline unit and the water outlet pipeline unit, wherein the pump unit drives the working medium in the action space to flow out from the water outlet pipeline unit, and drives the working medium to flow in from the water inlet pipeline unit
Implementation Method 3
the cooling liquid is connected to the electronic elements to be dissipated, and the heated cooling liquid can flow to a lower temperature for heat exchange
Data Source
AI summary
A heat dissipation device is provided and includes: a casing; a base unit combined with the casing to form a water collecting chamber, a water inlet chamber, an action space and a water outlet chamber; a heat transfer structure disposed on an inner side of the base unit; a water inlet pipeline unit communicated with the water collecting chamber; a water outlet pipeline unit communicated with the water outlet chamber; and a pump unit disposed outside the casing and the base unit, and connected with the water inlet pipeline unit and the water outlet pipeline unit, so as to drive a working medium.