Dual-Side Heat Sink for GPU Thermal Dissipation
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Solution Overview
Problem
Conventional thermal dissipation methods for graphics processing units (GPUs) in electronic assemblies are inefficient due to long heat dissipation paths and obstruction by other electronic components, leading to overheating.
Innovation Solution
A thermal dissipation structure comprising a heat sink with fin plates on one side and heat dissipating members exposed through openings on the opposing side of the printed circuit board, allowing for efficient heat transfer to cooling airflow on both sides of the assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heat sink with extended portion is used to dissipate heat from GPU, then the heat sink can receive cooling airflow, but the heat dissipation path is too long and heat dissipation efficiency is poor
Solution Approach 1:
The patent applies dimensionality change by extending heat dissipating members from the traditional single-side configuration to a dual-side configuration through the printed circuit board. The heat dissipating members protrude from both the first side and second side of the PCB, creating a three-dimensional heat dissipation structure that utilizes airflow from multiple directions simultaneously, thereby reducing the effective heat dissipation path length and improving thermal efficiency.
Solution Approach 2:
The heat sink is segmented into multiple heat dissipating members that are distributed across both sides of the printed circuit board. Instead of using a single extended portion, the patent divides the heat dissipation function into multiple discrete members (such as fins or pins) that can independently interact with airflow from different directions, increasing the overall heat dissipation surface area and efficiency.
2Adaptability or versatility
If additional electronic assembly is connected in front of GPU, then the assembly can be mounted on motherboard, but heat circulation is restrained causing overheating
Solution Approach 1:
The patent overcomes the spatial obstruction caused by adjacent electronic assemblies by transitioning from a planar, single-side heat dissipation approach to a three-dimensional dual-side configuration. The heat dissipating members extend through the PCB to protrude from both sides, allowing airflow to access heat dissipation surfaces from multiple directions simultaneously, thereby bypassing the blocking effect of neighboring components and maintaining effective heat circulation.
3Ease of operation
If heat sink extended portion bends over outer edge of graphics card, then the structure can receive airflow, but the extended portion provides poor thermal dissipation results
Solution Approach 1:
Instead of using a single bent extended portion, the patent segments the heat dissipation function into multiple discrete heat dissipating members distributed across both sides of the PCB. Each member can independently optimize its geometry and orientation for heat dissipation, and collectively they provide a much larger effective heat transfer surface area compared to a single bent portion, significantly improving thermal dissipation performance.
Solution Approach 2:
The patent improves thermal dissipation by transitioning from a two-dimensional bent extension on one side to a three-dimensional configuration with heat dissipating members protruding from both sides of the PCB. This dual-side arrangement creates additional heat transfer surfaces in multiple spatial dimensions, increasing the overall heat dissipation capacity and effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shortens the heat dissipation path and enhances thermal dissipation efficiency by allowing airflow to dissipate heat from both sides of the GPU, preventing overheating and improving cooling performance.
Implementation Method 1
heat transfer to cooling airflow
Implementation Method 2
dissipate heat from both sides of the GPU, preventing overheating and improving cooling performance
Data Source
AI summary
One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.