Microchannel-Integrated Substrate for Bottom Cooling in GPU-HBM Packages
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Solution Overview
Problem
Current thermal management systems for semiconductor devices, particularly high-performance memory and processor modules, face challenges in dissipating heat efficiently due to space constraints and limited effectiveness of top-mounted heat spreaders, leading to performance limitations in high-capacity and high-bandwidth devices.
Innovation Solution
Integration of microchannels within the substrate of semiconductor packages to facilitate heat dissipation by flowing a coolant through these channels, which are designed to convey thermal energy away from memory and logic devices, enhancing heat removal from beneath the devices while traditional heat sinks handle top heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If top-mounted heat spreaders and heat sinks are used, then heat dissipation from the top of semiconductor devices is improved, but insufficient heat dissipation remains to meet performance specifications
Solution Approach 1:
The heat dissipation system is segmented into two independent pathways: top-mounted heat spreaders for upper surface heat removal and substrate-integrated microchannels for bottom heat removal. This segmentation allows each component to specialize in heat dissipation from its respective direction, collectively meeting performance specifications that neither could achieve alone.
Solution Approach 2:
The invention transitions from single-direction (top-only) heat dissipation to multi-directional heat dissipation by adding the bottom heat removal pathway through substrate microchannels. This dimensional expansion enables heat to be extracted from both the top and bottom surfaces of the semiconductor devices simultaneously.
2Productivity
If higher density of components is used to make devices smaller and more powerful, then device capacity and performance are improved, but heat generation increases creating thermal management challenges
Solution Approach 1:
The thermal management system is segmented into multiple heat extraction pathways (top heat spreaders and bottom microchannels) to handle the increased heat load from high-density components. This segmented approach distributes the thermal management burden across multiple channels, enabling effective cooling of high-performance devices.
Solution Approach 2:
The invention employs fluid-based cooling through microchannels etched into the substrate, where coolant flow hydraulically removes heat from the bottom of semiconductor devices. This hydraulic cooling mechanism provides efficient heat transfer capability necessary for managing heat from high-density, high-performance components.
3Volume of moving object
If space constraints are considered in module design, then compactness is improved, but clearance for heat exchanging structures above the memory module is limited
Solution Approach 1:
Instead of relying solely on top-mounted heat exchange structures that require clearance above the module, the invention inverts the heat extraction approach by integrating microchannels into the substrate for bottom-up heat removal. This inversion eliminates the need for significant top clearance while maintaining effective heat exchange capability.
Solution Approach 2:
The heat exchange capability is extended to the vertical dimension by utilizing the substrate plane for microchannel heat removal. This allows heat dissipation to occur in the horizontal plane through the substrate rather than requiring vertical clearance above the module, enabling compact design without sacrificing thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively addresses the thermal management challenges by improving heat dissipation from both the top and bottom of semiconductor devices, ensuring that high-performance specifications are met even in space-constrained environments.
Implementation Method 1
flowing a coolant through these channels, which are designed to convey thermal energy away from memory and logic devices
Implementation Method 2
Integration of microchannels within the substrate of semiconductor packages to facilitate heat dissipation
Data Source
AI summary
Semiconductor packages and/or assemblies having microchannels, a microchannel module, and/or a microfluidic network for thermal management, and associated systems and methods, are disclosed herein. The semiconductor package and/or assembly can include a substrate integrated with a microchannel and a coolant disposed within the microchannel to dissipate heat from a memory device and/or a logic device of the semiconductor package and/or assembly. The microchannel can be configured beneath the memory device and/or the logic device.