Multi-Tile GPU Memory Management for Lower Cache Access Latency

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Solution Overview

Problem

Current graphics processing units (GPUs) face challenges in maximizing parallel processing efficiency and cache management, leading to suboptimal performance in graphics and machine-learning operations due to limitations in thread execution and data access latency.

Innovation Solution

The implementation of a multi-tile memory management system that optimizes cache access latency through L3 cache-aware dispatching and kernel execution, utilizing a general-purpose graphics processing unit (GPGPU) architecture with SIMT architectures and dedicated circuitry for efficient command processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If traditional cache management is used in GPUs, then device complexity is reduced, but cache access latency increases leading to suboptimal performance

Engineering Contradiction:
Improvecache access latencyVSAvoidmemory management complexity
Core Design Contradiction:
Loss of timeVSDevice complexity

Solution Approach 1:

The L3 cache is divided into multiple tiles, each associated with specific processing clusters. This segmentation allows data to be distributed across multiple cache tiles, enabling parallel access and reducing latency for different data sets while maintaining manageable complexity through modular organization.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a new dimension to cache management by implementing multi-tile awareness in the dispatching mechanism. Instead of traditional single-dimension cache access, the system evaluates multiple cache tiles simultaneously and selects the optimal tile for data access, adding a spatial dimension to cache management that reduces access latency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If multi-tile memory management is implemented, then cache access latency is reduced, but device complexity increases

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidmemory management complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The system performs preliminary analysis of data locations across multiple cache tiles before actual data access occurs. The dispatching mechanism pre-evaluates which cache tiles contain the required data and prepares the optimal access path in advance, reducing actual access latency while managing complexity through advance planning.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The multi-tile cache system implements feedback mechanisms where access patterns from processing clusters are monitored and used to dynamically adjust dispatching decisions. This feedback loop allows the system to learn from actual performance data and optimize cache tile selection, improving productivity while keeping complexity manageable through adaptive control.

Inventive Principle:
Principle #23Feedback

3Productivity

If L3 cache-aware dispatching is used, then parallel processing efficiency is maximized, but device complexity increases

Engineering Contradiction:
Improveparallel processing efficiencyVSAvoiddispatching mechanism complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The dispatching mechanism is designed to be dynamic, adapting its behavior based on the specific workload and data distribution across cache tiles. Rather than using a fixed complex algorithm, the system adjusts its dispatching strategy in real-time based on observed performance and data locations, maximizing parallel processing efficiency while managing complexity through adaptability.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS12182062B1Multi-tile memory management
Publication Date: 2024.12.31 INTEL CORP
  • US12182062B1 patent drawing
  • US12182062B1 patent drawing
  • US12182062B1 patent drawing

AI summary

Methods and apparatus relating to techniques for multi-tile memory management. In an example, a graphics processor includes an interposer, a first chiplet coupled with the interposer, the first chiplet including a graphics processing resource and an interconnect network coupled with the graphics processing resource, cache circuitry coupled with the graphics processing resource via the interconnect network, and a second chiplet coupled with the first chiplet via the interposer, the second chiplet including a memory-side cache and a memory controller coupled with the memory-side cache. The memory controller is configured to enable access to a high-bandwidth memory (HBM) device, the memory-side cache is configured to cache data associated with a memory access performed via the memory controller, and the cache circuitry is logically positioned between the graphics processing resource and a chiplet interface.