GPU Heat Radiating Structure Using Mesh to Contain Liquid Metal

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Solution Overview

Problem

The existing heat radiating structures for electronic components, such as GPUs and CPUs, face issues with leakage of liquid metal due to vibrations and shocks, leading to reduced heat transfer efficiency and potential short circuits, as liquid metal can react with copper and solder, and there is limited space for insulation walls.

Innovation Solution

A heat radiating structure that incorporates a porous material, like a mesh, impregnated with liquid metal, which is sandwiched between the heat generating element and the heat radiating element, with a recessed part in the heat radiating element to hold the mesh in place and a belt-shaped adhesive material to fix the non-abutment region, preventing leakage and misregistration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If liquid metal is used as heat transfer fluid, then heat transfer performance is improved, but leakage occurs under vibration and shock

Engineering Contradiction:
Improveheat transfer performanceVSAvoidliquid metal leakage
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The patent uses a porous material (such as a mesh or sponge) as a holder for the liquid metal. The porous structure allows the liquid metal to be retained through capillary action while preventing leakage under vibration and shock. The porous holder is sandwiched between the heat generating element and the heat radiating element, maintaining both heat transfer efficiency and preventing liquid metal loss.

Inventive Principle:
Principle #31Porous materials

2Reliability

If liquid metal is used for heat transfer, then heat transfer efficiency is improved, but short circuits may occur due to chemical reaction and electrical conductivity

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidshort circuit risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The porous holder confines the liquid metal within its structure, preventing it from leaking out and contacting peripheral electric elements such as capacitors. This physical containment eliminates the risk of short circuits while maintaining the high heat transfer efficiency of the liquid metal.

Inventive Principle:
Principle #31Porous materials

3Loss of substance

If porous material is sandwiched between heat generating element and heat radiating element, then liquid metal leakage is prevented, but misregistration may occur

Engineering Contradiction:
Improveliquid metal retentionVSAvoidporous material positioning
Core Design Contradiction:
Loss of substanceVSManufacturing precision

Solution Approach 1:

The patent introduces a recessed part in the heat radiating element that corresponds to the position of the porous holder. This recessed structure provides mechanical constraint in the thickness direction, preventing misregistration and displacement of the porous material while maintaining its liquid metal retention function.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Object-affected harmful factors

If insulation wall is installed between electric element and die, then short circuit risk is reduced, but space is consumed

Engineering Contradiction:
Improveshort circuit preventionVSAvoidavailable space
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The porous holder serves as both a liquid metal retention structure and a containment barrier, eliminating the need for separate insulation walls. By confining the liquid metal within the porous structure, the patent prevents short circuits without consuming additional space, as the porous holder integrates multiple functions in a compact form.

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents leakage of the heat transfer fluid and maintains heat transfer performance, while preventing misregistration of the porous material and reducing the risk of short circuits by retaining the liquid metal within the mesh and adhering the non-abutment region to the heat radiating element.

Implementation Method 1

a porous material which abuts on a surface of the electric component and into which a heat transfer fluid is impregnated

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

the liquid metal which has fluidity would leak out through a gap between the die and the heat radiating element... the liquid metal is impregnated into the mesh almost never leaks out and is maintained in the mesh

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240014098A1Heat radiating structure and electronic apparatus
Publication Date: 2024.01.11 LENOVO (SINGAPORE) PTE LTD
  • US20240014098A1 patent drawing
  • US20240014098A1 patent drawing
  • US20240014098A1 patent drawing

AI summary

A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.