Graded Adhesive Medium for Display Assembly Stress Management

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The mismatch in mechanical properties between different layers in electronic device assemblies, such as display screens, leads to stress concentration and increased likelihood of cracks in the cover glass, particularly under bending loads, which can result in device damage.

Innovation Solution

A graded adhesive medium with layers of varying mechanical properties, including Young's modulus, hardness, and toughness, is used to connect components like the cover glass and touch panel, minimizing stress and inhibiting crack growth. This medium is composed of a polymer composite with ceramic fillers like silica or zirconia, and is optically transparent to maintain display quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a single-layer adhesive medium is used to bind components, then the manufacturing process is simple, but stress concentration occurs due to mechanical property mismatch between different components

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidstress distribution
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The adhesive medium is divided into multiple layers, each with different mechanical properties. The first layer has mechanical properties closer to the first component (cover glass), while the second layer has mechanical properties closer to the second component (touch panel or display panel). This segmentation allows each layer to serve as a mechanical transition zone, reducing stress concentration at the component interfaces.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the adhesive medium (specifically different layers) are given different mechanical properties tailored to their local requirements. The first layer is designed with properties optimized for bonding to and protecting the cover glass, while the second layer is designed with properties optimized for bonding to and accommodating the touch panel or display panel. This local quality approach ensures optimal stress distribution at each interface.

Inventive Principle:
Principle #3Local quality

2Reliability

If layers with different mechanical properties are combined, then stress is minimized and damage resistance is improved, but the device becomes more complex

Engineering Contradiction:
Improvedamage resistanceVSAvoidadhesive structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The adhesive medium is constructed as a composite structure with multiple layers, where each layer is made of materials with specific mechanical properties. The first layer uses materials with mechanical properties intermediate between the cover glass and the second layer, while the second layer uses materials with mechanical properties intermediate between the first layer and the touch panel or display panel. This composite material approach systematically reduces stress concentration while maintaining a manageable structural complexity.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS11116096B2Medium for binding components in an assembly of an electronic device, a method of preparing the same, a display assembly of an electronic device, and a system for simulating mechanical behaviours of the electronic device and the medium
Publication Date: 2021.09.07 CITY UNIVERSITY OF HONG KONG
  • US11116096B2 patent drawing
  • US11116096B2 patent drawing
  • US11116096B2 patent drawing

AI summary

A medium for binding components in an assembly of an electronic device, a method of preparing the same, a display assembly of an electronic device, and a system for simulating mechanical behaviours of the electronic device and the medium. The medium including: a first layer of material defining a first portion arranged to connect with a first electronic component of the assembly; and a second layer of material defining a second portion having a set of mechanical properties with one or more values different from those in the first portion, and the second layer of material is arranged to connect with a second electronic component of the assembly; wherein the combination of the first layer of material and the second layer of material is arranged to minimize stress established in the first electronic component when the first electronic component combines with the second electronic component.