Graded-Porosity Build Platform for Metal AM Bonding and CTE Match

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing additive manufacturing build platforms face challenges in bonding and thermal expansion compatibility with print materials, leading to peeling and cracking, especially at high temperatures, and are either costly when using compatible materials or incompatible when using less expensive alternatives.

Innovation Solution

A bi-metallic build platform with a graded porosity surface layer, where the base is made of a first metal and the surface layer is made of a second metal compatible with the print material, featuring a most-dense region at the top and a least-dense region at the bottom, addressing adhesion and CTE issues while being cost-effective.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If build platform is made entirely of material compatible with print material (e.g., stainless steel, nickel-based alloys), then adhesion and thermal expansion compatibility are improved, but manufacturing cost and operating cost increase significantly

Engineering Contradiction:
Improveadhesion and thermal expansion compatibilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The build platform is segmented into two distinct parts: a base made of cost-effective material (e.g., carbon steel) and a surface layer made of print material-compatible material (e.g., nickel-based alloy). This segmentation allows each part to be optimized independently for its specific function while reducing overall cost.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The build platform uses a composite structure combining dissimilar materials - a carbon steel base with a nickel-based alloy surface layer. This composite approach leverages the cost advantages of carbon steel while obtaining the adhesion and CTE compatibility benefits of nickel-based alloys only where needed at the print interface.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If build platform is made of lower cost materials (e.g., carbon steel), then manufacturing cost is reduced, but adhesion and thermal expansion compatibility with print material deteriorate, causing peeling and cracking

Engineering Contradiction:
Improvemanufacturing costVSAvoidadhesion and thermal expansion compatibility
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The surface layer is applied locally only where print material contact occurs, providing compatible material properties exactly where needed. The graded porosity structure concentrates the compatible material at the print interface while allowing the cost-effective base material to extend slightly beyond the print area for structural support and cost reduction.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The surface layer incorporates a graded porosity structure with higher porosity (5-25%) at the bottom interface and lower porosity (0-4.9%) at the top print interface. This porous structure enhances adhesion to the base while maintaining compatibility with print material, preventing peeling and cracking through improved bonding and stress distribution.

Inventive Principle:
Principle #31Porous materials

3Ease of manufacture

If build platform uses incompatible materials, then manufacturing cost is reduced, but build failure increases due to peeling and cracking at the interface

Engineering Contradiction:
Improvemanufacturing costVSAvoidbuild success rate
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The graded porosity structure in the surface layer acts as a cushioning mechanism that anticipates and mitigates thermal expansion mismatches and bonding stresses before they cause failure. The porous structure absorbs and distributes stresses, preventing the propagation of cracks and peeling that would lead to build failure.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The bi-metallic build platform ensures strong adhesion and thermal expansion compatibility with print materials, reducing build failures at elevated temperatures and lowering production costs compared to platforms made entirely of compatible materials.

Implementation Method 1

Coefficient of thermal expansion (CTE) compatibility of the build platform to the print material is another characteristic to be considered. Significant differences in CTE can result in separation of the bond between the print material and the build platform resulting in a build failure.

Methodology Applied
Scientific EffectThermal expansion compatibility: Thermal Expansion

Implementation Method 2

the ability of the print material to wet and bond (weld) to the build platform is advantageous. Where the print material does not bond (weld) well to the build platform, it can result in peeling/cracking at the interface resulting in a build failure of the 3D part.

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentEP4647192A1Build platform for additive manufacturing and related method
Publication Date: 2025.11.12 GENERAL ELECTRIC TECH GMBH
  • EP4647192A1 patent drawingFigure 1
  • EP4647192A1 patent drawingFigure 2A~3A
  • EP4647192A1 patent drawingFigure 2B~3B

AI summary

A build platform for a metal additive manufacturing process and a related method are disclosed. The build platform includes a base including a first metal and an upper surface. The build platform also includes a surface layer on the upper surface of the base including a second metal different than the first metal. The surface layer has a graded porosity having a most-dense region at an upper surface of the surface layer and a least-dense region at a lower surface of the surface layer. The lower surface of the surface layer contacts the upper surface of the base.