Dicing Blade with Graded Diamond Density for Wear Control

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Solution Overview

Problem

Existing dicing blades used for individualizing semiconductor devices experience uneven wear, leading to size differences in the individualized semiconductor devices due to variations in blade density and metal particle distribution.

Innovation Solution

A dicing blade design featuring a first blade portion with a lower density of diamond particles and metal particles, surrounded by a second blade portion with a higher density of diamond particles, which enhances the durability and cutting capability of the edge portion while maintaining the regenerative power of the central portion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the dicing blade uses uniform diamond particle distribution, then the manufacturing is simple, but uneven wear occurs leading to size differences in individualized semiconductor devices

Engineering Contradiction:

Improvesize consistency of individualized semiconductor devicesVSAvoiddiamond particle distribution structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating different diamond particle densities in different regions of the dicing blade. The first blade portion (central region) has a first diamond particle density, while the second blade portion (edge region) has a second diamond particle density that is higher than the first. This non-uniform distribution compensates for wear patterns, ensuring consistent cutting performance and size accuracy across all individualized semiconductor devices throughout the blade's service life.

Inventive Principle:

Principle #3Local quality

2Strength

If the dicing blade edge portion has high durability, then the cutting capability is enhanced, but the central portion may wear down faster reducing regenerative power

Engineering Contradiction:

Improvedurability and cutting capability of edge portionVSAvoidregenerative power and service life of central portion

Core Design Contradiction:

StrengthVSDuration of action of moving object

Solution Approach 1:

The patent implements local quality by tailoring diamond particle density to the specific functional requirements of each blade region. The edge portion (second blade portion) receives higher diamond particle density to enhance durability and cutting capability where the cutting force is concentrated. The central portion (first blade portion) maintains lower diamond particle density to preserve regenerative power and extend service life, as this region benefits from continuous exposure of fresh diamond particles during rotation.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent applies segmentation by dividing the dicing blade into distinct functional zones: a first blade portion (central region) with lower diamond particle density and a second blade portion (edge region) with higher diamond particle density. This segmentation allows each zone to be optimized independently for its specific operational role, balancing durability needs at the edge with regenerative power needs at the center.

Inventive Principle:

Principle #1Segmentation

3Reliability

If the dicing blade uses high density diamond particles throughout, then cutting performance is improved, but metal particle distribution becomes uneven affecting blade stability

Engineering Contradiction:

Improvecutting performance consistencyVSAvoidmetal particle distribution uniformity

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by creating region-specific diamond and metal particle distributions. The first blade portion (central region) contains metal particles with a first density, while the second blade portion (edge region) contains metal particles with a second density. This localized approach ensures that metal particles are properly distributed to stabilize the bonding layer in each region, preventing uneven wear and maintaining cutting performance consistency throughout the blade's operation.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed dicing blade design reduces uneven wear, maintains consistent cutting performance, and minimizes size variations in individualized semiconductor devices by optimizing diamond particle and metal particle distribution across the blade.

Implementation Method 1

a dicing blade may be used to individualize the semiconductor device by mechanically grinding scribe lanes formed in the semiconductor device

Methodology Applied

Scientific EffectMechanical grinding: Abrasion

Data Source

PatentUS12208541B2Dicing blade including diamond particles

Publication Date: 2025.01.28 SAMSUNG ELECTRONICS CO LTD

AI summary

A dicing blade includes: a first blade portion and a second blade portion at least partially surrounding the first blade portion, wherein the first blade portion includes: a first bonding layer; first diamond particles disposed in the first bonding layer and having a first density in the first bonding layer; and first metal particles disposed in the first bonding layer, and wherein the second blade portion includes: a second bonding layer at least partially surrounding the first bonding layer; and second diamond particles disposed in the second bonding layer and having a second density in the second bonding layer, wherein the second density is higher than the first density.