Graded InAlGaN Cap Layer for Semiconductor Contact Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices with InAlGaN cap layers achieve reduced potential barriers between the cap and electron-supplying layers but result in increased barriers between the ohmic electrode and the cap layer, limiting the reduction of contact resistance.
Innovation Solution
A semiconductor device with a cap layer composition of (InyAl1-y)zGa1-zN that monotonically decreases in z towards the ohmic electrode, maintaining lattice match with the channel layer, to reduce the potential barrier between the ohmic electrode and the cap layer, thereby reducing contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the InAlN ratio in the cap layer is increased to reduce the potential barrier with the electron-supplying layer, then the polarization charge increases and potential barrier decreases, but the lattice match with the channel layer becomes more difficult to maintain
Solution Approach 1:
The cap layer is designed with spatially varying composition: the region near the channel layer maintains composition optimized for lattice matching (lower InAlN ratio), while the region near the electron-supplying layer has higher InAlN ratio optimized for reducing potential barrier. This local quality variation allows simultaneous satisfaction of lattice match requirements and electrical contact requirements.
Solution Approach 2:
The cap layer functions as a composite structure with graded composition, combining regions of different InAlN ratios to achieve multiple functions: lattice matching with the channel layer, reduced potential barrier with the electron-supplying layer, and optimized contact with the ohmic electrode. This composite approach resolves the contradiction between lattice match precision and electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively lowers contact resistance by reducing the potential barrier between the ohmic electrode and the cap layer, allowing for a semiconductor device with sufficiently reduced contact resistance.
Implementation Method 1
a cap layer, provided on the electron-supplying layer and creating lattice match with the channel layer
Implementation Method 2
z for the cap layer monotonically decreases as being farther away from the electron-supplying layer... potential barrier between the ohmic electrode and the cap layer can be reduced
Data Source
AI summary
A semiconductor device includes a channel layer, an electron-supplying layer provided on the channel layer, a cap layer provided on the electron-supplying layer and creating lattice match with the channel layer, and ohmic electrodes provided on the cap layer. The cap layer has a composition of (InyAl1-y)zGa1-zN (0≦y≦1, 0≦z≦1). The z for such cap layer monotonically decreases as being farther away from the electron-supplying layer.


