On-Chip Spatial Analog Optical Computing with Graded-Index Media

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Solution Overview

Problem

Existing technologies face challenges in integrating wave-based computation systems with nanophotonic circuits due to spherical aberration and diffraction limits, and there is a lack of understanding in fabricating inhomogeneous and anisotropic materials for spatial analog optical computing on chips, limiting flexibility and functionality.

Innovation Solution

An integrated computing platform using a semiconductor substrate with a backgate electrode, graded index media sections, and a meta-transmit array (MTA) is developed, leveraging graphene/Ge to perform Fourier transforms and minimize absorption loss, compatible with CMOS technology.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If wave-based computation is performed on optical tables with customized setups, then computing operations can be performed with low power consumption, but the complex structure and bulky optical components prevent integration with nanophotonic circuits and cause spherical aberration and diffraction limits

Engineering Contradiction:
Improvepower consumptionVSAvoidstructure complexity
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent replaces bulky mechanical optical components with integrated photonic circuits fabricated on a chip. The optical waveguide structure substitutes traditional optical tables and customized optical setups, enabling wave-based computation while achieving compact integration and eliminating spherical aberration and diffraction limits associated with bulk optical components.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from three-dimensional bulk optical components to two-dimensional integrated photonic circuits on a planar chip substrate. This dimensional reduction enables integration with nanophotonic circuits while maintaining the wave-based computation functionality and reducing power consumption.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If inhomogeneous and anisotropic materials are fabricated to manipulate electromagnetic waves on a chip, then promising results are achieved, but the achievable length scales, interface/surface quality, geometries, and materials combinations are far from providing the required flexibility in anisotropy and inhomogeneity

Engineering Contradiction:
Improveelectromagnetic wave manipulationVSAvoidmaterial attribute flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent implements local quality by creating spatially varying material properties within the photonic crystal structure. The periodic modulation of refractive index in different regions enables localized control of electromagnetic wave propagation, achieving both reliable wave manipulation and flexible adaptation to different computational requirements through geometric configuration.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses composite photonic crystal structures combining different materials with complementary properties. The integration of various dielectric materials with distinct refractive indices and anisotropic characteristics enables precise control over electromagnetic wave manipulation while providing the required flexibility in material attributes for different computational functions.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If conventional fabrication methods are used for integrated optical computing platforms, then manufacturing is simplified, but the interface/surface quality and geometrical precision are insufficient for achieving required tolerance levels

Engineering Contradiction:
Improvefabrication simplicityVSAvoidinterface quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent employs parameter changes by systematically optimizing fabrication parameters such as etch depth, layer thickness, and pattern dimensions to achieve the required manufacturing precision. The photonic crystal geometry parameters are carefully controlled during fabrication to ensure interface quality and geometrical precision while maintaining ease of manufacture through standardized processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables faster and lower power consumption computations by utilizing highly confined surface waves on graphene, achieving efficient computation in the spatial Fourier domain with improved integration and tolerance.

Implementation Method 1

The one or more graded index media sections are configured to perform a fourier transform (FT) of a wave

Methodology Applied
Scientific EffectFourier transform:

Implementation Method 2

one or more graded index media sections on a top surface of the semiconductor substrate

Methodology Applied
Scientific EffectGraded index:

Implementation Method 3

utilizing highly confined surface waves on graphene

Methodology Applied
Scientific EffectSurface wave confinement:

Implementation Method 4

One or more graded index media sections can include a graphene layer on the top or front surface of the dielectric layer

Methodology Applied
Scientific EffectGraphene: Graphene

Implementation Method 5

a meta-transmit array (MTA) on the top side of the semiconductor substrate and adjacent to the one or more graded index media sections

Methodology Applied
Scientific EffectMetasurface modulation:

Data Source

PatentUS20250334994A1Integrated platform for on-chip spatial analog optical computing
Publication Date: 2025.10.30 UNM RAINFOREST INNOVATIONS
  • US20250334994A1 patent drawing
  • US20250334994A1 patent drawing
  • US20250334994A1 patent drawing

AI summary

An integrated computing platform for performing spatial analog optical computing on a chip and a method for fabricating an integrated computing platform is disclosed. The computing platform includes a semiconductor substrate with a backgate electrode on a bottom side of the substrate. The integrated computing platform includes one or more graded index media sections on a top surface of the substrate which may include a grooved recess, and a meta-transmit array (MTA) on the top side of the substrate and adjacent to the graded index media sections. The method for fabricating the integrated computing platform includes etching a surface of a semiconductor substrate to create a plurality of sharp v-shaped grooves in a surface of the semiconductor substrate, creating a plurality of paraboloid-shaped grooves in the surface of the semiconductor substrate and filling the plurality of paraboloid-shaped grooves with a dielectric material.