Graded Dielectric Lens Antenna for Efficient On-Chip Millimeter Waves
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Solution Overview
Problem
Conventional on-chip millimeter wave antennas suffer from reduced radiation efficiency due to most radiated power being concentrated in silicon, leading to high electromagnetic coupling and low radiation resistance, limiting their effectiveness in wireless communication devices.
Innovation Solution
Incorporating a graded dielectric lens with decreasing dielectric constants and a ground plane to reflect electromagnetic radiation back into the air, enhancing directivity and radiation efficiency, while maintaining a high separation between the antenna and ground plane to minimize coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional on-chip antenna is used with silicon substrate, then the antenna can be integrated on chip, but most radiated power is concentrated in silicon resulting in low radiation efficiency
Solution Approach 1:
A ground plane is introduced as an intermediary element between the antenna and the silicon substrate. The ground plane reflects electromagnetic radiation that would otherwise be absorbed by the silicon, redirecting it back into the air. This mediator structure prevents direct coupling between the antenna and silicon, reducing power loss while maintaining on-chip integration capability
Solution Approach 2:
The separation height between the antenna and ground plane is optimized as a critical parameter. By adjusting this distance to specific values, the reflection coefficient and radiation pattern are controlled to maximize radiation efficiency. The parameter optimization transforms the harmful silicon coupling into a beneficial reflective structure
2Volume of moving object
If the separation between antenna and ground plane is reduced, then device size is minimized, but electromagnetic coupling increases reducing radiation resistance
Solution Approach 1:
The problem of coupling in the vertical dimension is addressed by introducing a lateral dimension element - the ground plane extends laterally beyond the antenna footprint. This dimensional extension creates a shielding effect that reduces electromagnetic coupling even when vertical separation is minimized, allowing compact design without sacrificing radiation resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the radiation efficiency and directivity of on-chip antennas, enabling better performance in low-power millimeter wave transceivers and facilitating beam steering for 5G applications by optimizing the interface match between the antenna and air.
Implementation Method 1
a ground plane to reflect electromagnetic radiation back into the air
Implementation Method 2
Incorporating a graded dielectric lens with decreasing dielectric constants... optimizing the interface match between the antenna and air
Data Source
AI summary
Some embodiments include packages and methods of making the packages. One of the packages includes a ground layer (e.g., a ground plane) of metal formed over a chip of die, an antenna element of metal formed over the ground layer, and a dielectric lens formed over the antenna element. The dielectric lens includes a plurality of dielectric layers that have graded dielectric constants in a decreasing order along a direction from the antenna element toward a top surface of the package.