Ceramic Electronic Device with Graded Sb/Sn Connection Member
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Solution Overview
Problem
Ceramic electronic devices with metal terminals face challenges in achieving favorable heat resistance when the connection member is used in excess, leading to potential cracks in chip components and reduced durability.
Innovation Solution
A ceramic electronic device design featuring a conductive connection member with varying Sb/Sn ratios and distances between terminal electrodes and metal terminals, where a second part with a smaller gap and higher Sb/Sn ratio enhances connection strength and heat resistance, preventing cracks and ensuring reliability even with a reduced connection member usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the use amount of connection member is increased to improve durability and heat resistance, then the connection strength is improved, but the chip component may develop cracks
Solution Approach 1:
The connection member is designed with non-uniform Sb/Sn composition: the first region (near metal terminal) has Sb/Sn of 0.03-0.3, while the second region (near chip component) has Sb/Sn of 0.3-1.0. This local differentiation allows the second region to provide strong bonding to the chip component without requiring excessive connection member material, thereby preventing cracks while maintaining heat resistance.
2Object-affected harmful factors
If the use amount of connection member is decreased to prevent cracks in chip component, then the risk of cracking is reduced, but the heat resistance and connection strength deteriorate
Solution Approach 1:
The Sb/Sn ratio parameter is changed spatially within the connection member. By increasing Sb content (higher Sb/Sn ratio) in the second region that contacts the chip component, the connection strength and heat resistance are enhanced locally, allowing reduced overall connection member usage without compromising reliability.
3Ease of manufacture
If a connection member with uniform Sb content is used, then the manufacturing is simplified, but the joint reliability during temperature rising is insufficient
Solution Approach 1:
The connection member features localized compositional variation where the second region (distance 0.01-0.05mm from chip component) has higher Sb/Sn ratio (0.3-1.0) compared to the first region (0.03-0.3). This local quality enhancement at the critical chip component interface improves joint reliability during thermal cycling without significantly complicating the overall manufacturing process.
Data Source
AI summary
A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.