Graded Semiconductor Package for EMI Shielding and Lensing
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Solution Overview
Problem
Conventional semiconductor packages made from uniform materials face challenges in integrating external devices like antennas, leading to mistaken faults and space constraints, as they lack the flexibility to provide advanced functionalities such as EMI/EMC protection and radiation management.
Innovation Solution
A graded package is developed with spatially varying material properties in three dimensions, using a combination of materials like polymers, doped polymers, and carbon nanomaterials, allowing for functionalities like lensing, waveguiding, and EMI/EMC shielding, which are achieved by a printer system that controls the deposition of materials based on a designed grading pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a uniform material package is used for semiconductor devices, then the manufacturing process is simple and cost-effective, but the package cannot provide advanced functionalities such as EMI/EMC protection, lensing, or waveguiding without additional external devices
Solution Approach 1:
The patent applies local quality by creating a graded package where material properties (such as dielectric constant, loss tangent, or conductivity) vary spatially within the package structure. Different regions of the package have different material compositions tailored to provide specific functions: EMI shielding in certain zones, lensing characteristics in others, and waveguiding properties in additional regions. This eliminates the need for separate external devices while maintaining functional versatility within a single integrated package structure.
Solution Approach 2:
The patent employs composite materials by combining multiple materials with different properties in a graded manner within the package. The package structure integrates materials with varying dielectric constants, conductivities, and other electromagnetic properties to achieve multiple functionalities simultaneously. This composite approach allows the package to provide EMI/EMC protection, antenna integration, lensing, and waveguiding capabilities without requiring additional external components.
2Adaptability or versatility
If external devices like antennas are integrated with semiconductor packages, then advanced functionalities are achieved, but the overall device size increases and users may mistakenly fault the package
Solution Approach 1:
The patent merges the package structure with antenna and other device integration functionalities by incorporating graded material properties directly into the package. The graded package itself serves as the antenna structure and EMI shielding mechanism, eliminating the need for separate external antenna components. This integration reduces the overall device volume while maintaining advanced functional capabilities for wireless communication and signal processing.
Solution Approach 2:
The patent achieves multi-functionality by designing the package to simultaneously provide protection, EMI/EMC shielding, antenna functionality, lensing, and waveguiding capabilities through its graded material structure. This universal package design eliminates the need for multiple separate components, reducing device volume while enhancing functional capability. The graded package becomes a multi-functional integrated structure that performs multiple roles that would traditionally require separate external devices.
3Adaptability or versatility
If external devices are added to semiconductor packages, then functionalities like EMI protection are achieved, but the risk of user errors and mistaken faults increases
Solution Approach 1:
The patent merges EMI protection, antenna functionality, and other advanced features directly into the package structure through graded material properties. This integration eliminates the need for users to separately assemble or configure external EMI shielding and antenna components, thereby reducing the risk of user errors and mistaken faults. The graded package provides these functionalities as an integrated, pre-configured unit that cannot be incorrectly assembled by the user.
4Adaptability or versatility
If a graded package with spatially varying material properties is manufactured, then advanced functionalities are achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies parameter changes by systematically varying material properties (dielectric constant, conductivity, loss tangent) as continuous gradients within the package structure. This approach enables the creation of complex functional profiles through controlled parameter transitions rather than discrete material layering. The graded parameter variations can be achieved through advanced manufacturing techniques such as 3D printing, additive manufacturing, or controlled material deposition, which allow for precise spatial control of material properties while maintaining manufacturing feasibility.
Data Source
AI summary
Methods and apparatus providing a graded package for a semiconductor are disclosed. An example apparatus includes a die; and a graded package encapsulating the die, the graded package including a material that is spatially varied from a first location of the graded package to a second location of the graded package.