Gradient-Filler Adhesive Film for Copper Ion Barrier Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing film-like adhesives are insufficient in preventing the movement of heavy metal ions, particularly copper ions, which can cause operation defects in semiconductor packages due to diffusion into silicon crystals.
Innovation Solution
A film-like adhesive with a resin composition containing a filler, featuring a region near the surface with a decreasing filler content, providing a barrier function to prevent heavy metal ion movement, and a dicing/die-bonding integrated film incorporating this adhesive for semiconductor manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a film-like adhesive with uniform filler distribution is used, then mechanical strength is maintained, but heavy metal ion diffusion cannot be effectively prevented
Solution Approach 1:
The adhesive film employs a gradient filler distribution where the filler content rate decreases from the second surface toward the first surface. This creates a resin-rich region near the first surface that acts as a barrier to heavy metal ion diffusion, while maintaining adequate filler content in other regions to preserve mechanical strength. The local variation in filler concentration resolves the contradiction between ion barrier performance and structural complexity.
2Reliability
If gettering processing is performed on ultrathin wafers, then heavy metal ion trapping is improved, but the wafer becomes difficult to handle and may develop cracks
Solution Approach 1:
The adhesive film serves as an intermediary barrier between the ultrathin wafer and the environment containing heavy metal ions. Instead of performing gettering processing directly on the fragile wafer, the adhesive film's resin-rich region intercepts and prevents heavy metal ion diffusion, thereby protecting the wafer from ion contamination without compromising its mechanical integrity or requiring additional processing steps that could cause cracks.
3Strength
If filler content is increased throughout the adhesive film, then mechanical strength is improved, but barrier function against heavy metal ions is reduced
Solution Approach 1:
The adhesive film employs a gradient filler distribution where the filler content rate decreases from the second surface toward the first surface. This creates a resin-rich region near the first surface that acts as a barrier to heavy metal ion diffusion, while maintaining adequate filler content in other regions to preserve mechanical strength. The local variation in filler concentration resolves the contradiction between ion barrier performance and structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive effectively prevents heavy metal ion diffusion, enhancing the reliability of semiconductor devices by reducing defects and maintaining mechanical strength.
Implementation Method 1
the film-like adhesive has a region in the vicinity of the first surface, the region in which the content rate of the filler decreases from the second surface side toward the first surface side... the film-like adhesive having a barrier function of preventing movement of heavy metal ions
Data Source
AI summary
A film-like adhesive containing a thermosetting resin component; and a filler, in which the film-like adhesive has a single layer structure including a first surface and a second surface, and has a region in a vicinity of the first surface, the region in which a content rate of the filler decreases in a direction from the second surface toward the first surface.