Gradient Hollow-Particle Coating for Insulated Electronic Modules
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Solution Overview
Problem
Existing coating agents for electronic components fail to provide both thermal insulation and high insulation resistance, especially when used in injection molding processes, leading to potential connection failures and thermal deterioration.
Innovation Solution
A coating layer comprising a thermoplastic resin and hollow particles with a concentration gradient in the thickness direction, where the content of hollow particles is lower on the surface in contact with the circuit board, achieving both thermal insulation and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If hollow particles are added to the coating layer to improve thermal insulation, then thermal insulation properties are improved, but volume resistivity decreases and insulation resistance is lowered
Solution Approach 1:
The coating layer is designed with non-uniform hollow particle distribution, creating different local properties: the first region (near circuit board) has low hollow particle content for high insulation resistance, while the second region (outer layer) has high hollow particle content for excellent thermal insulation. This spatial differentiation resolves the contradiction between thermal insulation and insulation resistance.
Solution Approach 2:
The solution transitions from a uniform single-layer coating to a multi-region structured coating with varying hollow particle concentrations through the thickness direction. This dimensional variation in particle distribution allows simultaneous optimization of thermal insulation and electrical insulation properties in different regions of the same coating layer.
2Object-affected harmful factors
If a uniform coating layer with high hollow particle content is applied to suppress heat transmission, then thermal insulation is improved, but the coating layer fails to maintain high volume resistivity
Solution Approach 1:
Different regions of the coating layer are assigned different hollow particle concentrations based on their functional requirements: the region adjacent to the circuit board maintains low particle content for electrical insulation, while the outer region uses high particle content for thermal insulation, resolving the contradiction between heat suppression and volume resistivity.
Solution Approach 2:
The coating layer is segmented into multiple regions with distinct hollow particle concentrations. This segmentation allows each region to independently fulfill its specific function (electrical insulation vs. thermal insulation) without compromising the other, overcoming the limitation of uniform coating structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coating layer effectively suppresses re-melting of solder and thermal deterioration, while maintaining excellent insulation resistance, thus ensuring the reliability of electronic components in modularized forms.
Implementation Method 1
the coating layer has a concentration gradient of hollow particles in the thickness direction such that the content of the hollow particles on the surface side in contact with the circuit board is lower
Implementation Method 2
excellent thermal insulation properties and high volume resistivity can be achieved at the same time in the coating layer containing the hollow particles by providing a concentration gradient of the hollow particles in the thickness direction
Data Source
AI summary
An electronic component having thermal insulation properties and insulation resistance, which is capable of being used for modularization by injection molding or the like. The electronic component has a circuit board on which an electronic element is mounted and a coating layer for coating the surface of the circuit board, wherein the coating layer contains at least a thermoplastic resin and hollow particles; and the coating layer has a concentration gradient of hollow particles in the thickness direction such that the content of the hollow particles in the coating layer is lower on the face side in contact with the circuit board.