Gradient Coil Cooling Channel External Placement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing gradient coil assemblies in MRI systems face challenges with high eddy currents and inefficient cooling, leading to increased heating and reduced cooling efficiency, especially in wide-bore systems.
Innovation Solution
The cooling channel is arranged outside and along the conductor lines of the gradient coil, with a U-shape or C-shape open at one side, allowing direct contact between the cooling fluid and the conductor lines, thereby enhancing cooling efficiency and reducing eddy currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cooling channel is placed inside the gradient coil, then the cooling fluid can be in close proximity to the conductor lines, but this arrangement generates high eddy currents and reduces cooling efficiency
Solution Approach 1:
The patent inverts the conventional cooling channel placement by moving it from the interior to the exterior of the gradient coil. The cooling channel is positioned in thermal contact with the outer surface of the gradient coil, allowing cooling fluid to flow outside the coil structure. This inversion eliminates eddy currents in the cooling channel while maintaining effective heat removal through the coil's outer surface.
2Reliability
If the cooling channel is arranged with a wall separating it from conductor lines, then the cooling fluid is isolated from the conductors, but this reduces cooling efficiency
Solution Approach 1:
The patent extracts the cooling channel from the interior space of the gradient coil and positions it externally. The cooling channel is formed in the support structure surrounding the gradient coil, allowing the cooling fluid to flow in direct thermal contact with the coil's outer surface without requiring an internal wall separation. This extraction achieves both electrical isolation and efficient cooling.
3Adaptability or versatility
If the gradient coil design is optimized for wide-bore systems, then the imaging capability is improved, but the gradient coil radius increases leading to higher power requirements and more difficult cooling
Solution Approach 1:
The patent transitions the cooling approach from an internal three-dimensional arrangement to an external surface-based cooling system. By positioning the cooling channel on the outer surface of the gradient coil and utilizing the coil's cylindrical geometry, the system achieves effective heat removal without increasing the coil's internal complexity or power consumption, even for wide-bore applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes eddy current losses, maintains efficient cooling, and allows for a compact design, effectively addressing the heating issues in gradient coil assemblies.
Implementation Method 1
the cooling channel is arranged outside and along the conductor lines of the gradient coil, with a U-shape or C-shape open at one side, allowing direct contact between the cooling fluid and the conductor lines
Implementation Method 2
a cooling fluid flowing in the cooling channel gets into direct contact with a part of the surface of the one or more conductor lines
Implementation Method 3
This heating is mainly caused by eddy currents and resistive heating as current is passed through the gradient coil
Implementation Method 4
This heating is mainly caused by eddy currents and resistive heating as current is passed through the gradient coil
Data Source
Figure 1~2
Figure 3~4
AI summary
The present invention is related to cooling a gradient coil (2) of a magnetic resonance imaging system (1). According to the invention, a gradient coil assembly for a magnetic resonance imaging system (1) is provided, the gradient coil assembly comprising at least one gradient coil (2) and a cooling arangement for cooling the gradient coil (2), wherein the gradient coil (2) is comprised of a solid electrical conductor material forming one conductor line (21) or more conductor lines (21, 31, 41) which are in direct contact with each other, the cooling arangement comprises a cooling channel (22, 32, 42) for guiding a cooling fluid (10), and the cooling channel (22, 32, 42) is arranged outside along the one or more conductor lines (21, 31, 41) in such a way that in a cross-sectional view one single continuous interface line between the cooling channel (22, 32, 42) and the one or more conductor (21, 31, 41) lines is formed. In this way efficient cooling of the gradient coil (2) may be achieved.