Integrated Gradient Radiator With Thermal Path Isolation
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Solution Overview
Problem
Robots with complex internal structures and multiple heating components face challenges in heat dissipation due to varying temperature requirements of low-temperature and high-temperature devices, leading to inefficient heat dissipation and complex radiator assemblies.
Innovation Solution
An integrated radiator with a temperature gradient, comprising a first heat dissipation unit for high-temperature devices and a second heat dissipation unit for low-temperature devices, is designed with isolated thermal conductive paths and insulating air gaps to facilitate simultaneous heat dissipation across different temperature ranges, allowing for a single assembly and improved thermal separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate radiators are used for low-temperature and high-temperature devices, then each device can be dissipated heat effectively, but the assembly becomes very complicated and space is restricted
Solution Approach 1:
The patent combines separate radiators for low-temperature and high-temperature devices into a single integrated radiator structure. The integrated radiator includes a first heat dissipation unit for the low-temperature device and a second heat dissipation unit for the high-temperature device, which are physically integrated but thermally isolated through an insulating air gap. This merging reduces the number of separate radiator assemblies while maintaining effective heat dissipation for both device types.
Solution Approach 2:
The integrated radiator is segmented into distinct heat dissipation units with isolated thermal conductive paths. The first heat dissipation unit and second heat dissipation unit are thermally separated to independently manage heat from different temperature zones, allowing each segment to optimize heat dissipation for its specific device type while being part of a unified structure.
2Reliability
If multiple radiators are assembled separately, then heat dissipation requirements are met, but the assembling procedures become very complicated
Solution Approach 1:
The patent integrates multiple heat dissipation units into a single radiator assembly that can be installed as one unit. The integrated radiator structure combines the first heat dissipation unit, second heat dissipation unit, and insulating air gap into a pre-assembled configuration, eliminating the need for complex on-site assembly of multiple separate radiators and reducing installation complexity.
3Volume of moving object
If radiators are closely arranged to save space, then space utilization improves, but thermal interference between low-temperature and high-temperature devices increases
Solution Approach 1:
The patent introduces an insulating air gap as a thermal intermediary between the first heat dissipation unit and second heat dissipation unit. This air gap acts as a thermal barrier that prevents heat from the high-temperature device from interfering with the low-temperature device, while still allowing the radiators to be closely integrated in space. The insulating air gap mediates the thermal interaction between the two heat dissipation units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated radiator achieves effective gradient regional heat dissipation, satisfying the heat dissipation needs of both high- and low-temperature devices while simplifying assembly and maintaining stable temperature environments, thus enhancing the operational efficiency of robots.
Implementation Method 1
A thermal conductive path of the first heat dissipation unit is isolated from a thermal conductive path of the second heat dissipation unit
Implementation Method 2
the first heat dissipation unit is physically connected to but thermally separated from the second heat dissipation unit
Implementation Method 3
the first heat dissipation unit is configured to maintain the high-temperature device within a first temperature range
Implementation Method 4
the second heat dissipation unit is configured to maintain the low-temperature device within a second temperature range
Data Source
AI summary
An integrated radiator having a temperature gradient is disposed between a high-temperature device and a low-temperature device. The integrated radiator includes a first heat dissipation unit and a second heat dissipation unit which are integrally fixed. The first heat dissipation unit is configured to maintain the high-temperature device within a first temperature range, and the second heat dissipation unit is configured to maintain the low-temperature device within a second temperature range. A thermal conductive path of the first heat dissipation unit is isolated from a thermal conductive path of the second heat dissipation unit, and the first heat dissipation unit is physically connected to but thermally separated from the second heat dissipation unit.