Graphene Nanocapillary Cooling Layers for Compact Semiconductor Packages
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Solution Overview
Problem
Conventional cooling mechanisms for semiconductor devices, such as those using graphene particles in sealing resins or heat pipes, face limitations in maintaining insulation while achieving effective heat dissipation, and often require increased size to enhance cooling capacity, which contradicts miniaturization and height reduction goals.
Innovation Solution
A nanocapillary structure composed of graphene layers and metal layers is used to create a cooling mechanism where a first graphene layer forms a nanocapillary channel on a metal layer, and a second graphene layer is bonded to form an opening for a refrigerant passage, with a second metal layer covering it, allowing for efficient heat transfer without increasing the device's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If graphene particles are mixed in sealing resin to improve thermal conductivity, then heat dissipation is improved, but insulation properties deteriorate when mixing amount is increased
Solution Approach 1:
The patent uses a nanocapillary structure with controlled porosity formed by graphene layers and metal particles. This porous structure enables capillary action to draw cooling liquid through the sealing resin, providing active cooling without requiring high concentrations of graphene particles, thus maintaining insulation properties while achieving effective heat dissipation.
Solution Approach 2:
The patent creates a composite material system combining sealing resin, metal particles (Cu, Al, or their alloys), and graphene layers. This composite structure leverages the thermal conductivity of metal particles and the capillary action enabled by graphene's layered structure, achieving superior heat dissipation while maintaining the insulation properties of the base sealing resin.
2Temperature
If heat dissipation fins or heat pipes are used to improve cooling capacity, then heat dissipation is improved, but device size increases
Solution Approach 1:
The patent embeds metal particles and nanocapillary channels directly within the sealing resin structure, creating a nested configuration where the cooling function is integrated into the existing package volume. This eliminates the need for external heat dissipation fins or heat pipes, achieving high cooling capacity without increasing device size.
Solution Approach 2:
The patent transitions from conventional macro-scale heat dissipation structures (fins, heat pipes) to a micro/nano-scale approach by dispersing metal particles and forming nanocapillary channels within the sealing resin. This dimensional change enables volumetric heat dissipation throughout the sealing resin, achieving high cooling capacity in a compact form factor.
3Temperature
If conventional cooling mechanisms are used, then heat dissipation is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated structure: the sealing resin simultaneously provides electrical insulation, structural sealing, and thermal management through embedded metal particles and nanocapillary channels. This merging eliminates the need for separate cooling components, reducing manufacturing complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat dissipation without compromising the miniaturization or height reduction of semiconductor packages, as the nanocapillary structure enhances thermal conductivity and prevents particle passage, ensuring efficient cooling while maintaining compact dimensions.
Implementation Method 1
graphene is suitable for use as a heat transfer filler because of its good thermal conductivity
Implementation Method 2
a nanocapillary structure constituted by graphene or the like
Data Source
AI summary
Conventional problems are solved by providing a cooling mechanism having a nanocapillary structure constituted by graphene, a semiconductor device including the cooling mechanism, a method for manufacturing the same, and an electronic device. A first metal layer, a first graphene layer formed on the first metal layer and having a nanocapillary channel, a second graphene layer joined to an upper surface of the nanocapillary channel to form an opening of a passage for a refrigerant, and a second metal layer covering the second graphene layer are included.