Graphene-Enhanced Circuit Board Insulating Layer Thermal Management
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Solution Overview
Problem
Existing circuit boards have poor heat dissipating performance, which affects their normal operation and longevity, especially in display devices where high thermal management is required.
Innovation Solution
A circuit board design incorporating a graphene-enhanced insulating layer with a metal foil layer, comprising stacked glass felt and glass cloth semi-cured layers, and a high thermal conductive adhesive layer, which improves thermal conductivity and rigidity, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional insulating materials are used in circuit board, then manufacturing cost is low and ease of manufacture is good, but thermal conductivity is poor leading to poor heat dissipation
Solution Approach 1:
The patent applies composite materials by combining glass felt semi-cured layer, glass cloth semi-cured layer, and graphene in the insulating layer. This composite structure achieves high thermal conductivity while maintaining electrical insulation properties, resolving the contradiction between heat dissipation performance and manufacturing feasibility.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the insulating layer by incorporating graphene with high thermal conductivity. This parameter change enables the insulating layer to achieve both electrical insulation and effective heat dissipation, overcoming the limitation of traditional insulating materials.
2Temperature
If single-layer insulating structure is used, then device complexity is low, but thermal management performance is insufficient
Solution Approach 1:
The patent segments the insulating layer into multiple functional sub-layers: glass felt semi-cured layer for thermal conduction, glass cloth semi-cured layer for structural support and insulation, and graphene for enhanced thermal management. This segmentation allows each layer to perform its specific function optimally, achieving superior thermal management while maintaining reasonable structural complexity.
Solution Approach 2:
The patent applies local quality by assigning different materials to different regions/layers of the insulating structure. Each layer is selected for its specific properties: glass felt for thermal pathways, glass cloth for mechanical strength and insulation, and graphene for high thermal conductivity. This localized material selection optimizes thermal management performance.
3Temperature
If glass felt semi-cured layer is used alone, then thermal conduction is improved, but structural rigidity and durability are insufficient
Solution Approach 1:
The patent merges glass felt semi-cured layer with glass cloth semi-cured layer to combine their complementary properties. The glass felt provides thermal conduction pathways, while the glass cloth contributes structural rigidity, mechanical strength, and electrical insulation. This merging resolves the contradiction between thermal conduction and structural integrity.
Solution Approach 2:
The patent uses composite materials by combining glass felt and glass cloth in the insulating layer structure. This composite approach allows the glass felt to provide thermal management functionality while the glass cloth reinforces structural properties, achieving both thermal conduction and structural rigidity simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances thermal conductivity and heat dissipation efficiency, ensuring better performance and longer lifetime of circuit boards and display devices by reducing heat transfer resistance and increasing durability.
Implementation Method 1
the provision of the graphene can effectively reduce the heat transfer resistance on the interface, so that the connection between the stacked glass felt semi-cured layer and the glass cloth semi-cured layer becomes closer, the heat transfer in the insulating layer becomes more directly effective, and the thermal conductivity of the circuit board is further enhanced
Data Source
AI summary
A circuit board and a display device are disclosed. The circuit board includes an insulating layer and a metal foil layer. The metal foil layer is disposed on a surface of the insulating layer. The insulating layer comprises the graphene. The insulating layer comprises a glass felt semicured layer and a glass cloth semicured layer. The glass felt semicured layer and the glass cloth semicured layer are stacked. The glass felt semicured layer includes a glass felt layer and a high thermal conductive adhesive layer covering a surface of the glass felt layer. The glass cloth semicured layer comprises a glass cloth layer and the high thermal conductive adhesive layer covering a surface of the glass cloth layer. The high thermal conductive adhesive layer comprises the graphene, and the glass felt semicured layer and the glass cloth semicured layer also comprise the graphene.