Graphene Circuit Board With Liquid Metal Shielding
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Solution Overview
Problem
Traditional circuit boards with via structures suffer from impedance discontinuity and inadequate electromagnetic interference (EMI) shielding in all directions, due to rough conductor structures and the skin effect of electrons.
Innovation Solution
A circuit board design utilizing graphene for conductive structures and graphene oxide for insulating structures, with liquid metal encapsulating differential lines to create individual shielding structures, achieving EMI shielding in all directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If via structures are used in traditional circuit boards to achieve signal shielding, then electromagnetic shielding is provided, but impedance discontinuity occurs
Solution Approach 1:
The patent removes traditional via structures from the circuit board design and replaces them with planar shielding layers integrated into the substrate. This extraction eliminates the impedance discontinuity caused by via holes while maintaining electromagnetic shielding through dedicated shielding traces and planes that are seamlessly incorporated into the circuit board layers.
Solution Approach 2:
The shielding layers in the patent serve multiple functions simultaneously: they provide electromagnetic shielding, maintain impedance continuity by being integrated into the signal path, and act as reference planes for differential pairs. This multi-functionality resolves the contradiction by making the shielding structure an integral part of the transmission line design rather than a separate component.
2Object-affected harmful factors
If electromagnetic shielding structures are added to microstrip and stripline structures, then EMI shielding is improved, but the shielding cannot achieve coverage in all directions
Solution Approach 1:
The patent transitions from traditional planar shielding to a three-dimensional shielding architecture by stacking multiple shielding layers at different heights and orientations within the circuit board. This dimensional approach creates overlapping shielding zones that cover all spatial directions, effectively blocking EMI from approaching from any angle while maintaining signal integrity.
3Ease of manufacture
If the roughness of conductor structure is high, then manufacturing is easier, but coupled with skin effect it increases conductor loss
Solution Approach 1:
The patent employs advanced conductor materials and surface treatments that reduce surface roughness while maintaining manufacturing feasibility. By changing the physical parameters of the conductor surface (smoother finish, controlled impedance surfaces), the patent minimizes skin effect losses at high frequencies while still using conventional fabrication processes to achieve the desired surface quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The circuit board design effectively reduces signal loss and provides comprehensive EMI shielding by leveraging the high conductivity and low roughness of graphene, the insulating properties of graphene oxide, and the phase change capabilities of liquid metal.
Implementation Method 1
Graphene has the properties of high electrical conductivity, high thermal conductivity, and low roughness, so it can reduce signal loss
Implementation Method 2
Graphene oxide is an insulator, so it can also reduce the impact of roughness on high-frequency signals
Implementation Method 3
The liquid metal of the present invention encapsulates (three-dimensional surrounding) differential lines, so that each of the transmission line groups has an individual shielding structure, thereby achieving shielding of signals in all directions
Implementation Method 4
If the roughness of the conductor structure may be high, coupled with the skin effect of electrons, it would further increases the loss of the conductor
Data Source
AI summary
A circuit board includes a first circuit layer, a second circuit layer, a third circuit layer, a first differential line group, a second differential line group, a third differential line group, and a fourth differential line group. The first differential line group and the third differential line group are disposed between the first circuit layer and the second circuit layer. The second differential line group and the fourth differential line group are disposed between the first circuit layer and the third circuit layer. A first distance between the first differential line group and the first circuit layer is less than a third distance between the third differential line group and the first circuit layer. A second distance between the second differential line group and the first circuit layer is less than a fourth distance between the fourth differential line group and the first circuit layer.