Conformal Graphene Coating via Laser or Plasma Sintering

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Solution Overview

Problem

The high cost and complexity of designing metal frames for various electronic components, such as main boards and speakers, hinder efficient assembly and maintenance, and make system upgrades difficult due to the need for multiple mold designs.

Innovation Solution

A method involving the deposition of a poly-p-xylene layer on an object's surface, followed by conversion into a graphene layer using either laser sintering or plasma-assisted sintering, enabling the formation of a conformal graphene thin film with excellent heat dissipation, wear-resistance, and hydrophobic properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal frames of different shapes and sizes are designed for various electronic components, then the electronic components can be fixed securely, but the mold making costs increase and assembly and maintenance become more difficult

Engineering Contradiction:
Improvefixing securityVSAvoidmold design complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a single standardized frame structure that can accommodate multiple different electronic components (main boards, batteries, speakers, cameras) through modular component mounting interfaces. This eliminates the need for custom metal frames for each component type, reducing mold making costs and simplifying assembly while maintaining secure fixing through the universal frame's standardized mounting mechanisms.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If metal frames are designed for different electronic components, then component fixation is achieved, but assembly and maintenance efficiency decrease

Engineering Contradiction:
Improvecomponent fixationVSAvoidassembly efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The universal frame enables standardized assembly procedures for all electronic components, allowing technicians to use the same assembly techniques and tools regardless of component type. This significantly improves assembly efficiency and maintains component fixation reliability through consistent mounting interfaces.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The frame design segments the electronic device into modular components that can be independently mounted, removed, and replaced. This segmentation allows for efficient assembly by pre-assembling component modules and enables easy maintenance by allowing individual component replacement without disassembling the entire device structure.

Inventive Principle:
Principle #1Segmentation

3Reliability

If metal frames are designed for different electronic components, then component mounting is possible, but system upgrades become difficult

Engineering Contradiction:
Improvecomponent mountingVSAvoidsystem upgrade capability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The universal frame provides standardized mounting interfaces that allow different electronic components to be mounted on the same frame structure. This enables system upgrades by allowing technicians to replace old components with new ones of different specifications while using the same frame, thereby maintaining component mounting reliability while significantly improving system upgrade capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The frame design incorporates dynamic adaptability through standardized interfaces that can accommodate various component sizes and shapes. This allows the system to evolve and upgrade by simply changing the mounted components rather than redesigning the entire frame structure, maintaining reliable mounting while enabling flexible system upgrades.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the direct formation of a graphene layer on electronic products, enhancing user experience through improved heat dissipation and durability while maintaining conformal properties, thus simplifying assembly and maintenance.

Implementation Method 1

converting the poly-p-xylene layer into a graphene layer by using a laser sintering process

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

converting the poly-p-xylene layer into a graphene layer by using a plasma assisted-sintering process

Methodology Applied
Scientific EffectPlasma: Plasma

Data Source

PatentUS12194566B2Method for producing graphene
Publication Date: 2025.01.14 ASUSTEK COMPUTER INC
  • US12194566B2 patent drawing
  • US12194566B2 patent drawing
  • US12194566B2 patent drawing

AI summary

A method for producing graphene, configured for forming a graphene layer on a surface of an object. The method includes steps of: depositing a poly-p-xylene material layer on the surface: and converting the poly-p-xylene material layer into a graphene layer by using a laser sintering process or a plasma-assisted sintering process.